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NCP3170ADR2G 参数 Datasheet PDF下载

NCP3170ADR2G图片预览
型号: NCP3170ADR2G
PDF下载: 下载PDF文件 查看货源
内容描述: 同步PWM开关转换器 [Synchronous PWM Switching Converter]
分类和应用: 转换器稳压器开关式稳压器或控制器电源电路开关式控制器光电二极管
文件页数/大小: 26 页 / 684 K
品牌: ONSEMI [ ONSEMI ]
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NCP3170  
In a typical converter design, the ESR of the output  
capacitor bank dominates the transient response. Please note  
that DV and DV are out of phase with each  
The equation reaches its maximum value with D = 0.5 at  
which point the input capacitance RMS current is half the  
output current. Loss in the input capacitors can be calculated  
with the following equation:  
_
OUT DIS  
OUT_ESR  
other, and the larger of these two voltages will determine the  
maximum deviation of the output voltage (neglecting the  
effect of the ESL). It is important to note that the converters  
frequency response will change when the NCP3170 is  
operating in synchronous mode or non-synchronous mode  
due to the change in plant response from CCM to DCM. The  
effect will be a larger transient voltage excursion when  
transitioning from no load to full load quickly.  
ǒ
Ǔ2  
PCIN + CINESR   IinRMS  
(eq. 21)  
ǒ
Ǔ2  
18 mW + 10 mW   1.34 A  
where:  
CIN  
= Input capacitance Equivalent Series  
Resistance  
ESR  
Iin  
= Input capacitance RMS current  
= Power loss in the input capacitor  
RMS  
Input Capacitor Selection  
P
CIN  
The input capacitor has to sustain the ripple current  
produced during the on time of the upper MOSFET, so it  
must have a low ESR to minimize losses and input voltage  
ripple. The RMS value of the input ripple current is:  
Due to large di/dt through the input capacitors, electrolytic  
or ceramics should be used. If a tantalum capacitor must be  
used, it must be surge protected, otherwise capacitor failure  
could occur.  
Ǹ
( )  
  D   1 * D ³  
IinRMS + IOUT  
(eq. 20)  
Ǹ
(
)
1.34 A + 3 A   27.5%   1 * 27.5%  
where:  
D
= Duty ratio  
Iin  
= Input capacitance RMS current  
= Load current  
RMS  
I
OUT  
POWER MOSFET DISSIPATION  
where:  
Power dissipation, package size, and the thermal  
environment drive power supply design. Once the  
dissipation is known, the thermal impedance can be  
calculated to prevent the specified maximum junction  
temperatures from being exceeded at the highest ambient  
temperature.  
Power dissipation has two primary contributors:  
conduction losses and switching losses. The high-side  
MOSFET will display both switching and conduction  
losses. The switching losses of the low side MOSFET will  
not be calculated as it switches into nearly zero voltage and  
the losses are insignificant. However, the body diode in the  
low-side MOSFET will suffer diode losses during the  
non-overlap time of the gate drivers.  
I
R
P
= RMS current in the high side MOSFET  
= On resistance of the high side MOSFET  
= Conduction power losses  
RMS_HS  
DS(ON)_HS  
COND  
Using the ra term from Equation 6, I  
becomes:  
RMS  
ra2  
ǸD   ǒ1 )  
Ǔ
(eq. 24)  
IRMS_HS + IOUT  
 
12  
where:  
D
ra  
I
I
= Duty ratio  
= Ripple current ratio  
= Output current  
OUT  
= High side MOSFET RMS current  
RMS_HS  
Starting with the high-side MOSFET, the power  
dissipation can be approximated from:  
The second term from Equation 22 is the total switching  
loss and can be approximated from the following equations.  
PD_HS + PCOND ) PSW_TOT  
(eq. 22)  
PSW_TOT + PSW ) PDS ) PRR  
(eq. 25)  
where:  
P
where:  
= Conduction losses  
= Power losses in the high side MOSFET  
= Total switching losses  
P
DS  
= High side MOSFET drain to source losses  
= High side MOSFET reverse recovery  
losses  
COND  
P
P
P
RR  
D_HS  
SW_TOT  
P
P
= High side MOSFET switching losses  
= High side MOSFET total switching losses  
SW  
The first term in Equation 21 is the conduction loss of the  
high-side MOSFET while it is on.  
SW_TOT  
Ǔ2  
(eq. 23)  
ǒ
PCOND + IRMS_HS   RDS(on)_HS  
http://onsemi.com  
17  
 
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