W3H128M72E-XSBX / W3H128M72E-XNBX
FIGURE 13 – PRECHARGE COMMAND
PRECHARGE COMMAND
The PRECHARGE command, illustrated in Figure 13, is used
to deactivate the open row in a particular bank or the open row
in all banks. The bank(s) will be available for a subsequent row
activation a specified time (tRP) after the PRECHARGE command
is issued, except in the case of concurrent auto precharge, where
a READ or WRITE command to a different bank is allowed as long
as it does not interrupt the data transfer in the current bank and
does not violate any other timing parameters. Once a bank has
been precharged, it is in the idle state and must be activated prior
to any READ or WRITE commands being issued to that bank. A
PRECHARGE command is allowed if there is no open row in that
bank (idle state) or if the previously open row is already in the
process of precharging. However, the precharge period will be
determined by the last PRECHARGE command issued to the bank.
CK#
CK
CKE
HIGH
CS#
RAS#
CAS#
WE#
PRECHARGE OPERATION
InputA10 determines whether one or all banks are to be precharged,
and in the case where only one bank is to be precharged, inputs BA2–
BA0 select the bank. Otherwise BA2–BA0 are treated as “Don’t Care.”
ADDRESS
A10
ALL BANKS
ONE BANK
BA
When all banks are to be precharged, inputs BA2–BA0 are treated
as “Don’t Care.” Once a bank has been precharged, it is in the
idle state and must be activated prior to any READ or WRITE
commands being issued to that bank. tRPA timing applies when the
PRECHARGE (ALL) command is issued, regardless of the number
of banks already open or closed. If a single-bank PRECHARGE
command is issued, tRP timing applies. tRPA (MIN) applies to all
8-bank DDR2 devices.
BA0 - BA2
DON’T CARE
NOTE: BA = bank address (if A10 is LOW; otherwise "Don't Care").
SELF REFRESH COMMAND*
The SELF REFRESH command can be used to retain data in the
DDR2 SDRAM, even if the rest of the system is powered down.
When in the self refresh mode, the DDR2 SDRAM retains data
without external clocking. All power supply inputs (including VREF
)
must be maintained at valid levels upon entry/exit and during SELF
REFRESH operation.
The SELF REFRESH command is initiated like a REFRESH
command except CKE is LOW. The DLL is automatically disabled
upon entering self refresh and is automatically enabled upon exiting
self refresh (200 clock cycles must then occur before a READ
command can be issued). The differential clock should remain
stable and meet tCKE specifications at least 1 x tCK after entering
self refresh mode. All command and address input signals except
CKE are “Don’t Care” during self refresh.
The procedure for exiting self refresh requires a sequence of
commands. First, the differential clock must be stable and meet
tCK specifications at least 1 x tCK prior to CKE going back HIGH.
Once CKE is HIGH (tCLE(MIN) has been satisfied with four clock
registrations), the DDR2 SDRAM must have NOP or DESELECT
commands issued for tXSNR because time is required for the
completion of any internal refresh in progress. A simple algorithm
for meeting both refresh and DLL requirements is to apply NOP
or DESELECT commands for 200 clock cycles before applying
any other command.
*NOTE:
Self refresh not available at military temperature above 95°C.
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4163.12E-0716-ss-W3H128M72E-XSBX / XNBX
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com