IBM3009K2672
IBM SONET/SDH Framer
Electrical and Thermal Characteristics
Absolute Maximum Ratings and Environmental Limitations
Symbol
VDD, VDD2
VIN1
Parameter
Min
3.0
-0.6
0.0
-40
-40
Max
Unit
V
Notes
1, 4
1, 3
1
Supply Voltage
3.6
5.5
Input Voltage (LVTTL)
V
VIN2
VDD
Input Voltage (LPECL/PPECL)
V
οC
οC
TS
Storage Temperature
125
85
1
TA
Ambient Operating Temperature Range (0 ft/min linear airflow)
Component Temperature x Time
οC x s
Level
%
TI
240 x 60
1, 5
ME
RH
RH
Moisture Exposure Level (JEDEC A112 level 2)
Relative Humidity, during assembly up to 1 year (JEDEC A112 level 2)
Relative Humidity, in-circuit non-condensing
Relative Humidity, shipment
2
60
80
--
5
8
2
6
%
--
%
ESD
ESD Classification (JEDEC class 2)
3
kV
1. Conditions exceeding the Min or Max values may cause permanent failure. Exposure to conditions near the Min or Max values for
extended periods may impair device reliability.
2. Pre-assembly storage in non-drypack conditions is not recommended. Refer to the instructions on the “CAUTION” label on the dry-
pack bag in which devices are supplied.
3. For this parameter, maximum value applies to overshoot; minimum value applies to undershoot.
4. Precautions have to be taken on the board to apply VDD and VDD2 simultaneously.
5. This is the maximum temperature and duration that this maximum temperature can be applied to the SONET/SDH framer module
during solder reflow on a printed circuit board before the SONET/SDH framer module is damaged. See also Temperature Limita-
tions / Board Processing on page 51.
6. Drypack required for shipment.
Electrical and Thermal Characteristics
Page 50 of 279
ssframer.01
8/27/99
IBM [ IBM ]
