IBM3009K2672
IBM SONET/SDH Framer
Temperature Limitations / Board Processing
The following limitations apply to CBGA-DLA packages:
1. Maximum number of thermal cycles above a particular temperature are cumulative (that is, 1 cycle above
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250 C is also 1 cycle above 220 C). Five reflow cycles are designated to board processing.
2. The temperature profile limitations during board assembly and rework reflow operations are:
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a. Maximum temperature: 260 C (for one reflow only);
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b. Maximum time above 250 C: 30 seconds (for one reflow only);
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c. Maximum temperature for reflows post one 260 C reflow: 240 C;
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d. Maximum time above 220 C: 60 seconds/cycle (5 cycles maximum);
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e. Maximum time above 183 C: 240 seconds/cycle (5 cycles maximum).
3. Double-sided two-pass assembly is permitted subject to the maximum thermal reflow count.
4. Double-sided two-pass assembly where the second pass is wave solder does not count as a reflow, pro-
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vided thermal exposure is less than 183 C.
Thermal Characteristics
Symbol
Parameter
Min
Typ
9.1
Max
11.6
Unit
Thermal Resistance - junction to ambient
0 ft/min linear airflow
οC/W
θJA
Power Requirements
Symbol
Parameter
Min
Typ
Max
3.45
1.34
4.62
1.06
3.67
Unit
V
Notes
VDD
IDD
PDD
IDD
Supply Voltage
3.15
3.30
1
1
Supply Current - 4 x STS-3c/STM-1
A
Power Dissipation - 4 x STS-3c/STM-1
4.1
3.3
W
A
1, 2
1
Supply Current - STS-12/STS-12c/STM-4/STM-4c
Power Dissipation - STS-12/STS-12c/STM-4/STM-4c
PDD
W
1
1. Power measurements are for either Telecom Bus mode or ATM/PPP mode but not both. Furthermore, if the Telecom Bus is not
used, the receive Telecom Bus outputs should be tri-stated.
2. A heat sink or airflow is required for 4 x STS-3c/STM-1 operation above 70 οC ambient air temperature.
ssframer.01
8/27/99
Electrical and Thermal Characteristics
Page 51 of 279
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