HC6856
28-LEAD FLAT PACK (22017362-001)
Optional capacitors
in cutout
All dimensions in inches
VDD
VSS
VDD
E
A
b
C
D
e
0.135 ± 0.015
1
1
0.015 ± 0.002
0.004 to 0.009
0.720 ± 0.008
0.050 ± 0.005 [1]
0.530 ± 0.008
b
(width)
E
TOP
VIEW
BOTTOM
VIEW
E2 0.420 ± 0.008
E3 0.055 ref
F
G
L
Q
S
U
V
W
X
Y
Z
e
(pitch)
0.650 ± 0.005 [2]
0.050 ± 0.005
0.295 min [3]
0.026 to 0.045
0.035 ± 0.010
0.065 ref
0.300 ref
0.050 ref
0.030 ref
0.100 ref
S
Z
U
L
Y
X
W
V
Kovar
Lid [4]
Cutout Ceramic
Area Body
A
Lead
Alloy 42
C
Q
G
0.080 ref
[1] BSC - Basic lead spacing between centers
[2] Where lead is brazed to package
[3] Parts delivered with leads unformed
[4] Lid connected to VSS
E2
E3
28-LEAD DIP (22017502-001)
For 28-Lead DIP description, see MIL-STD-1835, Type CDIP2-T28, Config. C, Dimensions D-10
DYNAMIC BURN-IN DIAGRAM
STATIC BURN-IN DIAGRAM
VDD
VDD
1
2
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
1
2
VSS
VSS
VDD
A14
A12
A7
VSS
VDD
NWE*
CE*
VSS
VSS
VDD
NWE*
CE*
VSS
VDD
A14
A12
A7
3
3
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
F0
F16
R
R
4
4
F17
F7
F6
5
5
A13*
A8
F15
F12
F11
F10
F17
F9
R
R
R
R
R
A13*
A8
6
6
A6
F5
A6
7
7
A5
A9
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
VSS
F4
A9
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
VSS
A5
8
8
A4
F3
A4
9
9
A3
F2
A3
10
11
12
13
14
15
16
17
18
10
11
12
13
14
15
16
17
18
A2
F8
R
R
A2
R
R
F17
F1
R
R
A1
F13
F14
F1
A1
A0
R
R
R
R
R
R
R
R
A0
R
R
R
R
DQO
DQ1
DQ2
F1
DQO
DQ1
DQ2
F1
F1
R
R
R
F1
F1
R
F1
NC
NC
VDD
VSS
VDD
VSS
VSS
VSS
VDD = 6.5V, R ≤ 10 KΩ, VIH = VDD, VIL = VSS
Ambient Temperature ≥ 125 °C, F0 ≥ 100 KHz Sq Wave
Frequency of F1 = F0/2, F2 = F0/4, F3 = F0/8, etc.
VDD = 5.5V, R ≤ 10 KΩ
Ambient Temperature ≥ 125 °C
NOTE — *Denotes package pinout option dependent (28-Lead DIP/FP diagrams not shown but have similar connections)
11
HONEYWELL [ Honeywell ]
