HC6856
PACKAGING
insertion. Ceramic chip capacitors can be mounted to the
package by the user to maximize supply noise decoupling
and increase board packing density. These capacitors
attach directly to the internal package power and ground
planes. This design minimizes resistance and inductance
of the bond wire and package, both of which are critical in
a transient radiation environment. All NC (no connect) pins
must be connected to either VDD, VSS or an active driver
to prevent charge build up in the radiation environment.
The 32K x 8 SRAM is offered in a custom 36-lead flat pack
(FP), 28-Lead FP, or standard 28-lead DIP. Each package
is constructed of multilayer ceramic (Al2O3) and features
internal power and ground planes. The 36-lead FP also
features a non-conductive ceramic tie bar on the lead
frame.Thepurposeofthetiebaristoallowelectricaltesting
of the device, while preserving the lead integrity during
shipping and handling, up to the point of lead forming and
28-LEAD DIP & FP PINOUT
36-LEAD FLAT PACK PINOUT
A14
A12
A7
A6
A5
A4
A3
A2
A1
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VDD
NWE
A13
A8
VSS
VDD
A14
A12
A7
1
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
VSS
VDD
NWE
CE
2
2
3
3
4
4
5
A13
A8
A6
6
5
A9
A5
7
A9
6
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
A4
8
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
VSS
Top
View
Top
View
A3
9
7
A2
10
11
12
13
14
15
16
17
18
8
A1
A0
9
DQ0
DQ1
DQ2
NC
A0
10
11
12
13
14
DQ0
DQ1
DQ2
VSS
VDD
VSS
36-LEAD FLAT PACK (22017194-001)
E
1
b
Top
(width)
Side
e
(pitch)
H
L
L
Non-
Conductive
Tie-Bar
Ceramic
Body
Optional
Standoff
Kovar
Lid [3]
A
J
0.004
C
M
S
N
I
X
Optional
Capacitors
All dimensions are in inches [1]
VDD
VSS
VSS
VDD
A
b
C
D
E
e
F
G
H
I
0.095 ± 0.010
0.008 ± 0.002
0.005 to 0.0075
0.650 ± 0.010
0.630 ± 0.007
0.025 ± 0.002 [2]
0.425 ± 0.005 [2]
0.525 ± 0.005
0.135 ± 0.005
0.030 ± 0.005
0.080 typ.
M
N
O
P
R
S
T
U
V
W
X
Y
0.008 ± 0.003
0.050 ± 0.010
0.090 ref
0.015 ref
0.075 ref
0.113 ± 0.010
0.050 ref
0.030 ref
0.080 ref
0.005 ref
Y
J
L
0.450 ref
0.400 ref
0.285 ± 0.015
1
[1] Parts delivered with leads unformed
[2] At tie bar
[3] Lid tied to VSS
1
O
T
V
W
P
U
R
10
HONEYWELL [ Honeywell ]
