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EP1AGX50DF780C6 参数 Datasheet PDF下载

EP1AGX50DF780C6图片预览
型号: EP1AGX50DF780C6
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 50160 CLBs, 640MHz, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780]
分类和应用: 现场可编程门阵列可编程逻辑LTE时钟
文件页数/大小: 296 页 / 3505 K
品牌: ALTERA [ ALTERA CORPORATION ]
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Arria GX Architecture  
Each I/O bank has its own VCCIOpins. A single device can support  
1.5-, 1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different  
VCCIO level independently. Each bank also has dedicated VREFpins to  
support the voltage-referenced standards (such as SSTL-2).  
Each I/O bank can support multiple standards with the same VCCIO for  
input and output pins. Each bank can support one VREF voltage level. For  
example, when VCCIO is 3.3 V, a bank can support LVTTL, LVCMOS, and  
3.3-V PCI for inputs and outputs.  
On-Chip Termination  
Arria GX devices provide differential (for the LVDS technology I/O  
standard) and series on-chip termination to reduce reflections and  
maintain signal integrity. There is no calibration support for these on-chip  
termination resistors. On-chip termination simplifies board design by  
minimizing the number of external termination resistors required.  
Termination can be placed inside the package, eliminating small stubs  
that can still lead to reflections.  
Arria GX devices provide two types of termination:  
Differential termination (RD)  
Series termination (RS)  
Altera Corporation  
May 2008  
2–119  
Arria GX Device Handbook, Volume 1  
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