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XC5202-5VQ100I 参数 Datasheet PDF下载

XC5202-5VQ100I图片预览
型号: XC5202-5VQ100I
PDF下载: 下载PDF文件 查看货源
内容描述: 现场可编程门阵列(FPGA)的\n [Field Programmable Gate Array (FPGA) ]
分类和应用: 现场可编程门阵列可编程逻辑时钟
文件页数/大小: 73 页 / 583 K
品牌: ETC [ ETC ]
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XC5200 Series Field Programmable Gate Arrays  
XC5200 Switching Characteristics  
Definition of Terms  
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as  
follows:  
Advance:  
Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device  
families. Use as estimates, not for production.  
Preliminary: Based on preliminary characterization. Further changes are not expected.  
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.  
1
XC5200 Operating Conditions  
Symbol  
Description  
Supply voltage relative to GND Commercial: 0°C to 85°C junction  
Supply voltage relative to GND Industrial: -40°C to 100°C junction  
High-level input voltage — TTL configuration  
Low-level input voltage — TTL configuration  
High-level input voltage — CMOS configuration  
Low-level input voltage — CMOS configuration  
Input signal transition time  
Min  
4.75  
4.5  
2.0  
0
Max  
5.25  
5.5  
Units  
V
VCC  
V
VIHT  
VILT  
VIHC  
VILC  
TIN  
VCC  
V
0.8  
V
70%  
0
100%  
20%  
250  
VCC  
VCC  
ns  
XC5200 DC Characteristics Over Operating Conditions  
Symbol  
VOH  
VOL  
Description  
High-level output voltage @ IOH = -8.0 mA, VCC min  
Low-level output voltage @ IOL = 8.0 mA, VCC max  
Quiescent FPGA supply current (Note 1)  
Leakage current  
Min  
Max  
Units  
V
7
3.86  
0.4  
15  
V
ICCO  
IIL  
mA  
µA  
pF  
-10  
+10  
15  
CIN  
Input capacitance (sample tested)  
IRIN  
Pad pull-up (when selected) @ VIN = 0V (sample tested)  
0.02  
0.30  
mA  
Note: 1. With no output current loads, all package pins at Vcc or GND, either TTL or CMOS inputs, and the FPGA configured with a  
tie option.  
XC5200 Absolute Maximum Ratings  
Symbol  
VCC  
Description  
Supply voltage relative to GND  
Units  
V
-0.5 to +7.0  
-0.5 to VCC +0.5  
-0.5 to VCC +0.5  
-65 to +150  
+260  
VIN  
Input voltage with respect to GND  
V
VTS  
TSTG  
TSOL  
TJ  
Voltage applied to 3-state output  
V
Storage temperature (ambient)  
°C  
°C  
°C  
°C  
Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)  
Junction temperature in plastic packages  
Junction temperature in ceramic packages  
+125  
+150  
Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress  
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Recommended  
Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may  
affect device reliability.  
1. Notwithstanding the definition of the above terms, all specifications are subject to change without notice.  
November 5, 1998 (Version 5.2)  
7-127  
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