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XCV200E-6FGG456I 参数 Datasheet PDF下载

XCV200E-6FGG456I图片预览
型号: XCV200E-6FGG456I
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456]
分类和应用: 时钟可编程逻辑
文件页数/大小: 99 页 / 927 K
品牌: XILINX [ XILINX, INC ]
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R
Spartan-II FPGA Family: DC and Switching Characteristics  
Calculation of T  
Capacitance  
as a Function of  
Constants for Calculating T  
IOOP  
IOOP  
(1)  
CSL  
FL  
Standard  
(pF)  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
50  
10  
10  
0
(ns/pF)  
TIOOP is the propagation delay from the O Input of the IOB  
to the pad. The values for TIOOP are based on the standard  
capacitive load (CSL) for each I/O standard as listed in the  
table "Constants for Calculating TIOOP", below.  
LVTTL Fast Slew Rate, 2 mA drive  
LVTTL Fast Slew Rate, 4 mA drive  
LVTTL Fast Slew Rate, 6 mA drive  
LVTTL Fast Slew Rate, 8 mA drive  
0.41  
0.20  
0.13  
For other capacitive loads, use the formulas below to  
calculate an adjusted propagation delay, TIOOP1  
.
0.079  
0.044  
0.043  
0.033  
0.41  
T
IOOP1 = TIOOP + Adj + (CLOAD – CSL) * FL  
LVTTL Fast Slew Rate, 12 mA drive  
LVTTL Fast Slew Rate, 16 mA drive  
LVTTL Fast Slew Rate, 24 mA drive  
LVTTL Slow Slew Rate, 2 mA drive  
LVTTL Slow Slew Rate, 4 mA drive  
LVTTL Slow Slew Rate, 6 mA drive  
LVTTL Slow Slew Rate, 8 mA drive  
LVTTL Slow Slew Rate, 12 mA drive  
LVTTL Slow Slew Rate, 16 mA drive  
LVTTL Slow Slew Rate, 24 mA drive  
LVCMOS2  
Where:  
Adj  
is selected from "IOB Output Delay  
Adjustments for Different Standards", page 59,  
according to the I/O standard used  
0.20  
CLOAD is the capacitive load for the design  
FL is the capacitance scaling factor  
0.100  
0.086  
0.058  
0.050  
0.048  
0.041  
0.050  
0.050  
0.033  
0.014  
0.017  
0.022  
0.016  
0.014  
0.028  
0.016  
0.029  
0.016  
0.035  
0.037  
Delay Measurement Methodology  
VREF  
Point Typ(2)  
Meas.  
(1)  
(1)  
Standard  
LVTTL  
VL  
VH  
0
3
1.4  
-
LVCMOS2  
PCI33_5  
PCI33_3  
PCI66_3  
GTL  
0
2.5  
1.125  
-
PCI 33 MHz 5V  
Per PCI Spec  
Per PCI Spec  
Per PCI Spec  
-
PCI 33 MHZ 3.3V  
-
PCI 66 MHz 3.3V  
-
GTL  
V
V
V
V
REF – 0.2 VREF + 0.2 VREF  
REF – 0.2 VREF + 0.2 VREF  
REF – 0.5 VREF + 0.5 VREF  
REF – 0.5 VREF + 0.5 VREF  
0.80  
1.0  
0.75  
0.90  
0.90  
1.5  
1.25  
1.5  
GTL+  
0
GTL+  
HSTL Class I  
20  
20  
20  
30  
30  
30  
30  
20  
10  
HSTL Class I  
HSTL Class III  
HSTL Class III  
HSTL Class IV  
HSTL Class IV VREF – 0.5 VREF + 0.5 VREF  
SSTL3 I and II VREF – 1.0 VREF + 1.0 VREF  
SSTL2 I and II VREF – 0.75 VREF + 0.75 VREF  
SSTL2 Class I  
SSTL2 Class II  
SSTL3 Class I  
CTT  
AGP  
V
REF – 0.2 VREF + 0.2 VREF  
VREF VREF VREF  
(0.2xVCCO) (0.2xVCCO  
SSTL3 Class II  
+
Per AGP  
Spec  
CTT  
)
AGP  
Notes:  
Notes:  
1. Input waveform switches between VL and VH.  
1. I/O parameter measurements are made with the capacitance  
values shown above. See Xilinx application note XAPP179  
for the appropriate terminations.  
2. I/O standard measurements are reflected in the IBIS model  
information except where the IBIS format precludes it.  
2. Measurements are made at VREF Typ, Maximum, and  
Minimum. Worst-case values are reported.  
3. I/O parameter measurements are made with the capacitance  
values shown in the table, "Constants for Calculating TIOOP".  
See Xilinx application note XAPP179 for the appropriate  
terminations.  
4. I/O standard measurements are reflected in the IBIS model  
information except where the IBIS format precludes it.  
DS001-3 (v2.8) June 13, 2008  
Product Specification  
www.xilinx.com  
Module 3 of 4  
60  
 
 
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