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XCV200E-6FGG456I 参数 Datasheet PDF下载

XCV200E-6FGG456I图片预览
型号: XCV200E-6FGG456I
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456]
分类和应用: 时钟可编程逻辑
文件页数/大小: 99 页 / 927 K
品牌: XILINX [ XILINX, INC ]
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R
Spartan-II FPGA Family: DC and Switching Characteristics  
VIL  
VIH  
VOL  
VOH  
IOL  
mA  
IOH  
mA  
Input/Output  
Standard  
V, Min  
–0.5  
V, Max  
V, Min  
V, Max  
3.6  
V, Max  
V, Min  
CTT  
AGP  
VREF – 0.2  
VREF – 0.2  
VREF + 0.2  
VREF + 0.2  
VREF – 0.4  
10% VCCO  
VREF + 0.4  
90% VCCO  
8
–8  
–0.5  
3.6  
Note (2)  
Note (2)  
Notes:  
1.  
VOL and VOH for lower drive currents are sample tested.  
2. Tested according to the relevant specifications.  
Switching Characteristics  
All devices are 100% functionally tested. Internal timing  
parameters are derived from measuring internal test  
patterns. Listed below are representative values. For more  
specific, more precise, and worst-case guaranteed data,  
use the values reported by the static timing analyzer (TRCE  
in the Xilinx Development System) and back-annotated to  
the simulation netlist. All timing parameters assume  
worst-case operating conditions (supply voltage and  
junction temperature). Values apply to all Spartan-II devices  
unless otherwise noted.  
(1)  
Global Clock Input to Output Delay for LVTTL, with DLL (Pin-to-Pin)  
Speed Grade  
All  
-6  
-5  
Symbol  
Description  
Device  
Min  
Max  
2.9  
Max  
3.3  
Units  
TICKOFDLL  
Global clock input to output delay  
using output flip-flop for LVTTL,  
12 mA, fast slew rate, with DLL.  
All  
ns  
Notes:  
1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and  
where all accessible IOB and CLB flip-flops are clocked by the global clock net.  
2. Output timing is measured at 1.4V with 35 pF external capacitive load for LVTTL. The 35 pF load does not apply to the Min values.  
For other I/O standards and different loads, see the tables "Constants for Calculating TIOOP" and "Delay Measurement  
Methodology," page 60.  
3. DLL output jitter is already included in the timing calculation.  
4. For data output with different standards, adjust delays with the values shown in "IOB Output Delay Adjustments for Different  
Standards," page 59. For a global clock input with standards other than LVTTL, adjust delays with values from the "I/O Standard  
Global Clock Input Adjustments," page 61.  
(1)  
Global Clock Input to Output Delay for LVTTL, without DLL (Pin-to-Pin)  
Speed Grade  
All  
-6  
Max  
4.5  
4.5  
4.5  
4.6  
4.6  
4.7  
-5  
Max  
5.4  
5.4  
5.4  
5.5  
5.5  
5.6  
Symbol  
Description  
Device  
XC2S15  
XC2S30  
XC2S50  
XC2S100  
XC2S150  
XC2S200  
Min  
Units  
ns  
TICKOF  
Global clock input to output delay  
using output flip-flop for LVTTL,  
12 mA, fast slew rate, without DLL.  
ns  
ns  
ns  
ns  
ns  
Notes:  
1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and  
where all accessible IOB and CLB flip-flops are clocked by the global clock net.  
2. Output timing is measured at 1.4V with 35 pF external capacitive load for LVTTL. The 35 pF load does not apply to the Min values.  
For other I/O standards and different loads, see the tables "Constants for Calculating TIOOP" and "Delay Measurement  
Methodology," page 60.  
3. For data output with different standards, adjust delays with the values shown in "IOB Output Delay Adjustments for Different  
Standards," page 59. For a global clock input with standards other than LVTTL, adjust delays with values from the "I/O Standard  
Global Clock Input Adjustments," page 61.  
DS001-3 (v2.8) June 13, 2008  
Product Specification  
www.xilinx.com  
Module 3 of 4  
54  
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