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XCV200E-6FGG456I 参数 Datasheet PDF下载

XCV200E-6FGG456I图片预览
型号: XCV200E-6FGG456I
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA456, FBGA-456]
分类和应用: 时钟可编程逻辑
文件页数/大小: 99 页 / 927 K
品牌: XILINX [ XILINX, INC ]
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Spartan-II FPGA Family:  
DCand Switching Characteristics  
DS001-3 (v2.8) June 13, 2008  
Product Specification  
Definition of Terms  
In this document, some specifications may be designated as Advance or Preliminary. These terms are defined as follows:  
Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or families. Values  
are subject to change. Use as estimates, not for production.  
Preliminary: Based on preliminary characterization. Further changes are not expected.  
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.  
Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are  
derived from measuring internal test patterns. All limits are representative of worst-case supply voltage and junction  
temperature conditions. Typical numbers are based on measurements taken at a nominal VCCINT level of 2.5V and a junction  
temperature of 25°C. The parameters included are common to popular designs and typical applications. All specifications  
are subject to change without notice.  
DC Specifications  
(1)  
Absolute Maximum Ratings  
Symbol  
VCCINT  
VCCO  
VREF  
Description  
Supply voltage relative to GND(2)  
Supply voltage relative to GND(2)  
Input reference voltage  
Min  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
–65  
-
Max  
3.0  
Units  
V
4.0  
V
3.6  
V
VIN  
Input voltage relative to GND(3)  
5V tolerant I/O(4)  
No 5V tolerance(5)  
5V tolerant I/O(4)  
No 5V tolerance(5)  
5.5  
V
VCCO + 0.5  
5.5  
V
VTS  
Voltage applied to 3-state output  
V
VCCO +0.5  
+150  
+125  
V
TSTG  
TJ  
Storage temperature (ambient)  
Junction temperature  
°C  
°C  
Notes:  
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress  
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions  
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.  
2. Power supplies may turn on in any order.  
3. VIN should not exceed VCCO by more than 3.6V over extended periods of time (e.g., longer than a day).  
4. Spartan®-II device I/Os are 5V Tolerant whenever the LVTTL, LVCMOS2, or PCI33_5 signal standard has been selected. With 5V  
Tolerant I/Os selected, the Maximum DC overshoot must be limited to either +5.5V or 10 mA, and undershoot must be limited to  
either –0.5V or 10 mA, whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may undershoot  
to –2.0V or overshoot to +7.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.  
5. Without 5V Tolerant I/Os selected, the Maximum DC overshoot must be limited to either VCCO + 0.5V or 10 mA, and undershoot must  
be limited to –0.5V or 10 mA, whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may  
undershoot to –2.0V or overshoot to VCCO + 2.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no  
greater than 100 mA.  
6. For soldering guidelines, see the Packaging Information on the Xilinx® web site.  
© 2000-2008 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other  
trademarks are the property of their respective owners.  
DS001-3 (v2.8) June 13, 2008  
Product Specification  
www.xilinx.com  
Module 3 of 4  
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