R
Virtex-II Platform FPGAs: Pinout Information
Table 3: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os
Available I/Os
XC2V
40
XC2V
80
XC2V
250
XC2V
500
XC2V
1000
XC2V
1500
XC2V
2000
XC2V
3000
XC2V
4000
XC2V
6000
XC2V
8000
Package
CS144
FG256
FG456
FG676
FF896
88
88
-
92
92
-
-
-
-
-
-
-
-
120
172
172
172
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
200
264
324
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
392
456
624
-
484
-
-
-
-
-
-
432
528
-
824
1,104
-
-
FF1152
FF1517
BG575
BG728
BF957
-
-
-
720
-
824
912
-
824
-
-
-
-
1,108
-
328
392
408
-
-
-
-
-
-
-
-
-
-
516
684
-
-
-
624
684
684
All of the devices supported in a particular package are
pinout compatible and are listed in the same table (one
table per package). In addition, the FG456 and FG676
packages are compatible, as are the FF896 and FF1152
packages. Pins that are not available for the smallest
devices are listed in right-hand columns.
Virtex-II Pin Definitions
This section describes the pinouts for Virtex-II devices in the
following packages:
•
•
•
CS144: wire-bond chip-scale ball grid array (BGA) of
0.80 mm pitch
FG256, FG456, and FG676: wire-bond fine-pitch BGA
of 1.00 mm pitch
Each device is split into eight I/O banks to allow for flexibility
in the choice of I/O standards (see the Virtex-II Data Sheet).
Global pins, including JTAG, configuration, and
power/ground pins, are listed at the end of each table.
Table 4 provides definitions for all pin types.
FF896, FF1152, FF1517: flip-chip fine-pitch BGA of
1.00 mm pitch
•
•
BG575 and BG728: wire-bond BGA of 1.27 mm pitch
BF957: flip-chip BGA of 1.27 mm pitch
The FG256 pinouts (Table 6) is included as an example. All
Virtex-II pinout tables are available on the distribution
CD-ROM, or on the web (at http://www.xilinx.com).
DS031-4 (v3.5) November 5, 2007
Product Specification
www.xilinx.com
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