WED9LC6816V
White Electronic Designs
PACKAGE DESCRIPTION: 153 LEAD BGA (17 X 9 BALL ARRAY)
JEDEC MP-163
3.50 (0.138)
MAX
14.00 (0.551)
BSC
A
B
C
D
E
F
PIN 1 INDEX
G
H
J
22.00 (0.866)
BSC
K
L
M
N
P
R
T
U
1.27 (0.050) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTE:
Ball attach pad for above BGA package is 480 microns in diameter. Pad is solder mask defined.
ORDERING INFORMATION
COMMERCIAL (0°C TA 70°C)
INDUSTRIAL (-40°C TA 85°C)
Part Number
SSRAM Access SDRAM Access
Part Number
SSRAM Access
200MHz
SDRAM Access
125MHz
WED9LC6816V2012BC
WED9LC6816V2010BC
WED9LC6816V1612BC
WED9LC6816V1610BC
WED9LC6816V1512BC
WED9LC6816V1510BC
WED9LC6816V1312BC
WED9LC6816V1310BC
200MHz
200MHz
166MHz
166MHz
150MHz
150MHz
133MHz
133MHz
125MHz
100MHz
125MHz
100MHz
125MHz
100MHz
125MHz
100MHz
WED9LC6816V2012BI
WED9LC6816V2010BI
WED9LC6816V1612BI
WED9LC6816V1610BI
WED9LC6816V1512BI
WED9LC6816V1510BI
WED9LC6816V1312BI
WED9LC6816V1310BI
200MHz
100MHz
166MHz
125MHz
166MHz
100MHz
150MHz
125MHz
150MHz
100MHz
133MHz
125MHz
133MHz
100MHz
Contact factory for ordering information.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
September, 2003
Rev. 1
26
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
