WED3DL644V
White Electronic Designs
Document Title
4M X 64 SDRAM BGA
Revision History
Rev #
History
Release Date Status
Rev 1
Rev 2
Rev 3
Initial release
August 2002
Preliminary
Die Shrink
May 2004
Final
3.1 Updated CAP and IDD specs
3.2 Added document title page
June 2004
Final
Rev 4
Rev 5
4.1 Changed operating temperature tOPR -40°C to +85°C back December 2004
to commercial temp rank 0°C to 70°C
Final
Final
5.1 Changed Maximum industrial temperature on order
infomation table to 85°C.
Demember 2004
5.2 Added Thermal Resistance Table
Rev 6
6.1 Replaced operating current table with updated and
corrected ICC specification
August 2005
Final
August 2005
Rev. 6
28
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
