New Product
SiS438DN
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V)
20
R
DS(on)
(Ω)
0.0095 at V
GS
= 10 V
0.0125 at V
GS
= 4.5 V
I
D
(A)
a, g
16
7.3 nC
16
Q
g
(Typ.)
FEATURES
•
Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET
®
Gen III Power MOSFET
• 100 % R
g
Tested
•
100 % UIS Tested
•
Compliant to RoHS Directive 2002/95/EC
PowerPAK
®
1212-8
APPLICATIONS
3.30 mm
S
1
2
3
4
D
8
7
6
5
D
D
D
S
S
G
3.30 mm
• DC/DC Conversion
• POL
D
G
Bottom View
Ordering Information:
SiS438DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel
MOSFET
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current
Avalanche Current
Avalanche Energy
Continuous Source-Drain Diode Current
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
L = 0.1 mH
Symbol
V
DS
V
GS
I
D
I
DM
I
AS
E
AS
I
S
Limit
20
± 20
16
a, g
16
g
14.3
b, c
11.3
b, c
32
g
15
11.25
16
a, g
2.9
b, c
27.7
17.7
3.5
b, c
2.2
b, c
- 55 to 150
260
Unit
V
A
mJ
A
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
Maximum Power Dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d, e
P
D
T
J
, T
stg
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Case (Drain)
t
≤
10 s
Steady State
Symbol
R
thJA
R
thJC
Typical
29
3.6
Maximum
36
4.5
Unit
°C/W
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 81 °C/W.
g. Package limited.
Document Number: 64826
S09-0876-Rev. A, 18-May-09
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