TLC5928
SBVS120A–JULY 2008–REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com
DEVICE INFORMATION
SO-24 AND TSSOP-24
DBQ AND PW PACKAGES
(TOP VIEW)
HTSSOP-24 PowerPAD
PWP PACKAGE
(TOP VIEW)
GND
1
2
3
4
5
6
7
8
9
24 VCC
GND
SIN
1
2
3
4
5
6
7
8
9
24 VCC
SIN
SCLK
LAT
23 IREF
23 IREF
22 SOUT
21 BLANK
20 OUT15
19 OUT14
18 OUT13
17 OUT12
16 OUT11
15 OUT10
14 OUT9
13 OUT8
SCLK
LAT
22 SOUT
21 BLANK
20 OUT15
19 OUT14
18 OUT13
17 OUT12
16 OUT11
15 OUT10
14 OUT9
13 OUT8
OUT0
OUT1
OUT2
OUT3
OUT4
OUT0
OUT1
OUT2
OUT3
OUT4
Thermal Pad
(Bottom Side)
TLC5928
TLC5928
OUT5 10
OUT6 11
OUT7 12
OUT5 10
OUT6 11
OUT7 12
QFN-24(1)
RGE PACKAGE
(TOP VIEW)
1
2
3
4
5
6
18 BLANK
LAT
OUT0
OUT1
OUT2
OUT3
OUT4
17 OUT15
16 OUT14
15 OUT13
14 OUT12
13 OUT11
Thermal Pad
(Bottom Side)
TLC5928
NOTE: Thermal pad is not connected to GND internally. The thermal pad must be connected to GND via the PCB pattern.
(1) Product preview device.
6
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Product Folder Link(s): TLC5928
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