欢迎访问ic37.com |
会员登录 免费注册
发布采购

BQ76925 参数 Datasheet PDF下载

BQ76925图片预览
型号: BQ76925
PDF下载: 下载PDF文件 查看货源
内容描述: 主机控制模拟前端用于3至6节锂离子/聚合物电池 [Host Controlled Analog Front End for 3 to 6 Series Cell Lithium-Ion/ Polymer Battery]
分类和应用: 电池
文件页数/大小: 29 页 / 742 K
品牌: TI [ TEXAS INSTRUMENTS ]
 浏览型号BQ76925的Datasheet PDF文件第1页浏览型号BQ76925的Datasheet PDF文件第2页浏览型号BQ76925的Datasheet PDF文件第3页浏览型号BQ76925的Datasheet PDF文件第5页浏览型号BQ76925的Datasheet PDF文件第6页浏览型号BQ76925的Datasheet PDF文件第7页浏览型号BQ76925的Datasheet PDF文件第8页浏览型号BQ76925的Datasheet PDF文件第9页  
bq76925  
SLUSAM9A JULY 2011REVISED JULY 2011  
www.ti.com  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
RANGE(2)  
MAX  
MIN  
UNITS  
Supply  
VBAT  
voltage  
range  
BAT  
0.3  
36  
V
Cell input differential, VCn to VCn+1, n = 0 to 5  
Cell input, VCn, n = 1 to 6  
0.3  
0.3  
10  
3  
9
(6 × n)  
10  
3
Input  
BAT to VC6 differential  
VI  
voltage  
range  
V
(3)  
VC0  
SENSEP, SENSEN  
SCL, SDA  
3  
3
0.3  
0.3  
0.3  
0.3  
0.3  
6
VCOUT, VIOUT, VREF  
VTB, V3P3  
3.6  
7
Output  
voltage  
range  
VO  
V
ALERT  
30  
36  
70  
70  
150  
VCTL  
ICB  
Cell balancing current  
Cell input current  
mA  
mA  
°C  
IIN  
25  
65  
TSTG  
Storage temperature range  
(1) Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings  
only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditionsis not implied. Exposure to absolutemaximumrated conditions for extended periods may affect device reliability.  
(2) All voltages are relative to VSS, except Cell input differential.  
(3) Negative voltage swings on VC0 in the absolute maximum range can cause unwanted circuit behavior and should be avoided.  
THERMAL INFORMATION  
bq76925  
TSSOP  
QFN  
(PW PACKAGE)  
(RGE PACKAGE)  
PRODUCT  
THERMAL METRIC(1)  
UNITS  
PREVIEW  
(20) PINS  
97.5  
31.7  
48.4  
1.5  
(24) PINS  
θJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
θJCtop  
θJB  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
ψJB  
47.9  
n/a  
θJCbot  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
4
Copyright © 2011, Texas Instruments Incorporated  
 复制成功!