MS18R1622(4/8)DH0
Physical Dimensions -1 ( For PCB )
The following defines the SO-RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate. The
dimensions without tolerance specification use the default tolerance of ±0.127[±0.005]. The maximum height of the module is 31.25mm
[1.23inches].
67.60±0.127[2.660±0.005]
4.30[0.17]
1.00[0.04]
59±0.1[2.323±0.004]
5.00±0.15
[0.196±0.006]
DIA 2.2
R1.00
COMPONENT AREA
(A SIDE)
+
+
6.75[0.266]
A-1
A-92
DETAIL A
DETAIL B
0.65[0.026]
25.35[0.99]
25.35[0.99]
4.00[0.157]
R 0.75
1.65[0.065]
3.00[0.118]
30.00±0.08[2.172±0.003]
37.6[1.48]
8.60[0.339]
B-1
B-92
0.92±0.02
[0.036±0.0008]
CSP
COMPONENT AREA
(B SIDE)
Min.4.3[0.17]
Note : The gray area above represents the contact surface of the heat spreader.
1.00±0.10
[0.039±0.004]
0.43±0.10
[0.017±0.004]
Heat spreader
0.65 [0.025]
4.00±0.10
[0.157±0.004]
Min.4.88
[0.192]
0.15±0.10
[0.006±0.004]
2.55±0.05
[0.10±0.002]
1.50±0.10
[0.059±0.004]
DETAIL A
DETAIL B
Figure 3: SO-RIMM Module PCB Physical Dimensions
Rev. 1.0 July 2002
Page10
SAMSUNG [ SAMSUNG ]
