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KFG1216U2B-SIB6 参数 Datasheet PDF下载

KFG1216U2B-SIB6图片预览
型号: KFG1216U2B-SIB6
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 32MX16, 70ns, PBGA67]
分类和应用: 内存集成电路
文件页数/大小: 120 页 / 1551 K
品牌: SAMSUNG [ SAMSUNG ]
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OneNAND512Mb(KFG1216U2B-xIB6)  
FLASH MEMORY  
4.0 DC CHARACTERISTICS  
4.1  
Absolute Maximum Ratings  
Parameter  
Symbol  
Rating  
-0.5 to + 4.6  
-0.5 to + 4.6  
-40 to +125  
-65 to +150  
5
Unit  
Vcc  
Vcc (for 3.3V)  
VIN (for 3.3V)  
Tbias  
Voltage on any pin relative to VSS  
V
All Pins  
Industrial  
Temperature Under Bias  
Storage Temperature  
°C  
°C  
Tstg  
Short Circuit Output Current  
IOS  
mA  
TA (Extended Temp.)  
TA (Industrial Temp.)  
-30 to +85  
-40 to +85  
Recommended Operating Temperature  
°C  
NOTES:  
1. Minimum DC voltage is -0.5V on Input/ Output pins. During transitions, this level should not fall to POR level(typ. 1.8V@3.3V device). Maximum DC  
voltage may overshoot to Vcc+2.0V for periods <20ns.  
2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions  
detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.  
4.2  
Operating Conditions  
Voltage reference to GND  
3.3V Device  
Typ.  
Parameter  
Symbol  
Unit  
Min  
2.7  
0
Max  
3.6  
0
VCC-core / Vcc  
VCC- IO / Vccq  
VSS  
3.3  
0
V
V
Supply Voltage  
NOTES:  
1. Vcc-Core (or Vcc) should reach the operating voltage level prior to or at the same time as Vcc-IO (or Vccq).  
96  
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