RT6263A/B
Add extra vias for thermal Dissipation.
GND
GND
Keep the SW node at small area
and keep analog components away
from the SW node to prevent stray
capacitive noise pickup.
CBOOT RBOOT
SW
REN
1
SW
CIN3
VIN
CFF
VOUT
GND
RFB1
RFB2
Place the feedback components
next to the FB pin.
The VIN trace should have
enough width, and use
several vias to shunt the
high input current.
RPG
L
CIN2
CSS
CIN1
VOUT
VIN
Place the input MLCC capacitors as
close to the VIN and GND pins as
possible.
COUT2
COUT1
GND
Connect feedback network behind
the output.
Figure 15. PCB Layout Guide
Copyright © 2020 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
DS6263A/B-00 January 2020
www.richtek.com
25
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