欢迎访问ic37.com |
会员登录 免费注册
发布采购

SPAKDSP303VF100 参数 Datasheet PDF下载

SPAKDSP303VF100图片预览
型号: SPAKDSP303VF100
PDF下载: 下载PDF文件 查看货源
内容描述: [Digital Signal Processor, 24-Ext Bit, 100MHz, CMOS, PBGA196, 15 X 15 MM, 1 MM PITCH, MOLD ARRAY PROCESS, BGA-196]
分类和应用: 时钟外围集成电路
文件页数/大小: 112 页 / 1117 K
品牌: MOTOROLA [ MOTOROLA ]
 浏览型号SPAKDSP303VF100的Datasheet PDF文件第104页浏览型号SPAKDSP303VF100的Datasheet PDF文件第105页浏览型号SPAKDSP303VF100的Datasheet PDF文件第106页浏览型号SPAKDSP303VF100的Datasheet PDF文件第107页浏览型号SPAKDSP303VF100的Datasheet PDF文件第108页浏览型号SPAKDSP303VF100的Datasheet PDF文件第109页浏览型号SPAKDSP303VF100的Datasheet PDF文件第111页浏览型号SPAKDSP303VF100的Datasheet PDF文件第112页  
Index  
Host Port Control Register (HPCR) 1-10,  
1-12  
N
host port  
non-multiplexed bus 1-2  
non-multiplexed bus timings  
read 2-33  
configuration 1-9  
usage considerations 1-9  
Host Port Control Register (HPCR) 1-10, 1-12  
Host Request  
write 2-34  
O
Double 1-2  
Single 1-2  
off-chip memory iii  
OnCE module iii  
Host Request (HR) 1-2  
Debug request 2-47  
I
on-chip DRAM controller iv  
On-Chip Emulation (OnCE) module  
interface 1-18  
information sources iv  
instruction cache iii  
internal clocks 2-4  
interrupt and mode control 1-1, 1-8  
interrupt control 1-8  
On-Chip Emulation module iii  
on-chip memory iii  
operating mode select timing 2-11  
interrupt timing 2-7  
P
external level-sensitive fast 2-10  
external negative edge-triggered 2-11  
synchronous from Wait state 2-11  
package  
144-pin TQFP 3-1  
196-pin MAP-BGA 3-1  
MAP-BGA description 3-10, 3-11, 3-12,  
3-15, 3-19  
J
Joint Test Action Group (JTAG)  
interface 1-18  
JTAG iii  
TQFP description 3-2, 3-3, 3-4, 3-6, 3-9  
Phase-Lock Loop (PLL) 1-1, 2-6  
design considerations 4-5  
performance issues 4-5  
PLL 1-4  
JTAG Port  
reset timing diagram 2-46  
timing 2-46  
JTAG/OnCE Interface signals  
Debug Event signal (DE signal) 1-18  
JTAG/OnCE port 1-1, 1-2  
Port A 1-1, 1-5, 2-13  
Port B 1-1, 1-2, 1-11  
Port C 1-1, 1-2, 1-13  
Port D 1-1, 1-2, 1-14  
Port E 1-1  
M
power 1-1, 1-2, 1-3  
power consumption  
MAP-BGA 3-1  
ball list by name 3-15  
ball list by number 3-12  
mechanical drawing 3-19  
molded array process-ball grid drawing  
(bottom) 3-11  
design considerations 4-4  
power consumption benchmark test A-1  
power management iv  
program memory expansion iv  
program RAM iii  
molded array process-ball grid drawing  
(top) 3-10  
R
maximum ratings 2-1, 2-2  
memory expansion port iii  
mode control 1-8  
recovery from Stop state using IRQA 2-12  
reset  
Mode select timing 2-7  
multiplexed bus 1-2  
multiplexed bus timings  
read 2-35  
clock signals 1-4  
interrupt signals 1-8  
JTAG signals 1-18  
mode control 1-8  
write 2-36  
OnCE signals 1-18  
PLL signals 1-4  
Index-2  
 复制成功!