1Gb: x4, x8, x16 DDR3 SDRAM
Electrical Specifications – IDD Specifications and Conditions
Table 18: IDD Measurement Conditions for IDD6, IDD6ET, and IDD8
IDD6: Self Refresh Current
IDD6ET: Self Refresh Current
Normal Temperature Range
TC = 0°C to +85°C
Extended Temperature Range
TC = 0°C to +95°C
IDD Test
IDD8: Reset2
Midlevel
Midlevel
N/A
CKE
LOW
LOW
External clock
tCK
tRC
Off, CK and CK# = LOW
Off, CK and CK# = LOW
N/A
N/A
N/A
N/A
N/A
tRAS
N/A
N/A
N/A
tRCD
N/A
N/A
N/A
tRRD
N/A
N/A
N/A
tRC
N/A
N/A
N/A
CL
N/A
N/A
N/A
AL
N/A
N/A
N/A
CS#
Midlevel
Midlevel
Midlevel
Midlevel
Midlevel
Enabled
Enabled, midlevel
N/A
Midlevel
Midlevel
Midlevel
Midlevel
Midlevel
Enabled
Enabled, midlevel
N/A
Midlevel
Midlevel
Midlevel
Midlevel
Midlevel
Midlevel
Midlevel
N/A
Command inputs
Row/column addresses
Bank addresses
Data I/O
Output buffer DQ, DQS
ODT1
Burst length
Active banks
Idle banks
SRT
N/A
N/A
None
N/A
N/A
All
Disabled (normal)
Disabled
Enabled (extended)
Disabled
N/A
ASR
N/A
1. “Enabled, midlevel” means the MR command is enabled, but the signal is midlevel.
Notes:
2. During a cold boot RESET (initialization), current reading is valid after power is stable
and RESET has been LOW for 1ms; During a warm boot RESET (while operating), current
reading is valid after RESET has been LOW for 200ns + tRFC.
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
42
2006 Micron Technology, Inc. All rights reserved.
MICRON [ MICRON TECHNOLOGY ]
