LTC1622
U
W U U
APPLICATIONS INFORMATION
The allowable forward voltage drop in the diode is calcu-
lated from the maximum short-circuit current as:
1
∆VOUT ≈IRIPPLE ESR +
8fCOUT
P
D
where f is the operating frequency, COUT is the output
capacitance and IRIPPLE is the ripple current in the induc-
tor. The output ripple is highest at maximum input voltage
since ∆IL increases with input voltage.
V ≈
F
I
SC(MAX)
where PD is the allowable power dissipation and will be
determined by efficiency and/or thermal requirements.
The choice of using a smaller output capacitance in-
creases the output ripple voltage due to the frequency
dependent term, but can be compensated for by using
capacitors of very low ESR to maintain low ripple voltage.
TheITH pinOPTI-LOOPcompensationcomponentscanbe
optimized to provide stable, high performance transient
response regardless of the output capacitors selected.
A fast switching diode must also be used to optimize
efficiency. Schottky diodes are a good choice for low
forwarddropandfastswitchingtimes. Remembertokeep
lead length short and observe proper grounding (see
Board Layout Checklist) to avoid ringing and increased
dissipation.
CIN and COUT Selection
Manufacturers such as Nichicon, United Chemicon and
Sanyoshouldbeconsideredforhighperformancethrough-
hole capacitors. The OS-CON semiconductor dielectric
capacitor available from Sanyo has the lowest ESR (size)
product of any aluminum electrolytic at a somewhat
higher price. Once the ESR requirement for COUT has been
met, the RMS current rating generally far exceeds the
In continuous mode, the source current of the P-channel
MOSFET is a square wave of duty cycle (VOUT + VD)/
(VIN + VD). To prevent large voltage transients, a low ESR
input capacitor sized for the maximum RMS current must
beused. ThemaximumRMScapacitorcurrentisgivenby:
1/2
]
IRIPPLE(P-P) requirement.
V
V − V
OUT
(
)
OUT IN
[
C Required I
≈I
In surface mount applications, multiple capacitors may
have to be paralleled to meet the ESR or RMS current
handling requirements of the application. Aluminum elec-
trolytic and dry tantalum capacitors are both available in
surfacemountconfigurations. Inthecaseoftantalum, itis
critical that the capacitors are surge tested for use in
switching power supplies. An excellent choice is the AVX
TPS, AVX TPSV and KEMET T510 series of surface mount
tantalum, available in case heights ranging from 2mm to
4mm.OthercapacitortypesincludeSanyoOS-CON,Sanyo
POSCAP, Nichicon PL series and the Panasonic SP series.
IN
RMS MAX
V
IN
This formula has a maximum at VIN = 2VOUT, where IRMS
= IOUT/2. This simple worst-case condition is commonly
usedfordesignbecauseevensignificantdeviationsdonot
offer much relief. Note that capacitor manufacturer’s
ripplecurrentratingsareoftenbasedon2000hoursoflife.
This makes it advisable to further derate the capacitor, or
to choose a capacitor rated at a higher temperature than
required. Several capacitors may be paralleled to meet the
size or height requirements in the design. Due to the high
operating frequency of the LTC1622, ceramic capacitors
can also be used for CIN. Always consult the manufacturer
if there is any question.
Low Supply Operation
Although the LTC1622 can function down to 2V, the
maximum allowable output current is reduced when VIN
decreasesbelow3V.Figure3showstheamountofchange
as the supply is reduced down to 2V. Also shown in
Figure3istheeffectofVIN onVREF asVIN goesbelow2.3V.
Remember the maximum voltage on the ITH pin defines
The selection of COUT is driven by the required effective
series resistance (ESR). Typically, once the ESR require-
ment is satisfied, the capacitance is adequate for filtering.
The output ripple (∆VOUT) is approximated by:
9
Linear [ Linear ]
