ML1451xx
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
SOG 20 = -5P
SOG PACKAGE
CASE 751G–02
(ML145157-5P, ML145158-5P)
–A–
16
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
8X P
0.010 (0.25)
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
M
M
B
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
J
16X D
M
S
S
0.010 (0.25)
T
A
B
F
MILLIMETERS
INCHES
DIM
A
B
C
D
MIN
10.15
7.40
2.35
0.35
0.50
MAX
10.45
7.60
2.65
0.49
0.90
MIN
MAX
0.411
0.299
0.104
0.019
0.035
0.400
0.292
0.093
0.014
0.020
R X 45°
C
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
–T–
0.25
0.10
0°
0.32
0.25
7°
0.010
0.004
0°
0.012
0.009
7°
M
SEATING
14X G
K
PLANE
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
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ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. Typical ” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
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