LANSDALE Semiconductor, Inc.
ML1451xx
OUTLINE DIMENSIONS
P DIP 20 = RP
PLASTIC DIP
CASE 738–03
(ML145156RP)
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
20
1
11
10
B
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
E
F
G
J
K
L
M
N
MIN
MAX
1.070
0.260
0.180
0.022
MIN
25.66
6.10
3.81
0.39
1.27 BSC
1.27
2.54 BSC
0.21
2.80
7.62 BSC
0°
0.51
MAX
27.17
6.60
4.57
0.55
1.010
0.240
0.150
0.015
-T-
K
SEATING
M
0.050 BSC
0.050
0.100 BSC
0.008
0.110
0.300 BSC
0°
0.020
PLANE
0.070
1.77
E
N
0.015
0.140
0.38
3.55
G
F
J 20 PL
D 20 PL
M
M
0.25 (0.010)
T
B
15°
0.040
15°
1.01
M
M
0.25 (0.010)
T
A
SOG 20 = -6P
SOG PACKAGE
CASE 751D–04
(MC145155-6P, MC145156-6P)
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOW ABLE
DAMBAR PROTRUSION SHALL BE 0.13
10X P
–B–
M
M
0.010 (0.25)
B
1
10
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
20X D
DIM
A
B
C
D
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
MAX
0.510
0.299
0.104
0.019
0.035
J
0.499
0.292
0.093
0.014
0.020
M
S
S
0.010 (0.25)
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
0.25
0.10
0°
0.32
0.25
7°
0.010
0.004
0°
0.012
0.009
7°
R X 45°
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
C
SEATING
–T–
PLANE
M
18X G
K
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