LANSDALE Semiconductor, Inc.
ML1451xx
OUTLINE DIMENSIONS
P DIP 28 = YP
PLASTIC DIP
CASE 710–02
(ML145151YP, ML145152YP)
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
28
1
15
14
B
MILLIMETERS
INCHES
DIM
A
B
C
D
F
MIN
36.45
13.72
3.94
0.36
1.02
MAX
37.21
14.22
5.08
0.56
1.52
MIN
MAX
1.435
0.540
0.155
0.014
0.040
1.465
0.560
0.200
0.022
0.060
L
A
C
N
G
H
J
K
L
M
N
2.54 BSC
0.100 BSC
1.65
0.20
2.92
2.16
0.38
3.43
0.065
0.008
0.115
0.085
0.015
0.135
J
H
G
M
K
SEATING
PLANE
15.24 BSC
15
1.02
0.600 BSC
15
0.020 0.040
F
D
0
0.51
°
°
0°
°
SO 28W = -6P
SOG PACKAGE
CASE 751F–04
(ML145151-6P, ML145152–6P)
-A-
NOTES:
28
1
15
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
14X P
M
M
-B-
0.010 (0.25)
B
14
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
28X D
M
M
S
S
0.010 (0.25)
T
A
B
R X 45°
MILLIMETERS
INCHES
C
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
17.80
7.40
2.35
0.35
0.41
1.27 BSC
0.23
0.13
MAX
MIN
MAX
-T-
18.05
0.701
0.292
0.093
0.014
0.016
0.711
-T-
7.60
2.65
0.49
0.90
0.299
0.104
0.019
0.035
26X G
SEATING
PLANE
K
F
0.050 BSC
0.009
0.005
0.32
0.29
0.013
0.011
8°
0.415
0.029
J
0°
8°
0°
10.05
0.25
10.55
0.75
0.395
0.010
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