ML1451xx
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
P DIP 16 = EP
PLASTIC DIP
CASE 648–08
(ML145157EP, ML145158EP)
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
9
B
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
2.54 BSC
1.27 BSC
0.21
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
0.100 BSC
0.050 BSC
0.008
C
L
S
SEATING
–T–
PLANE
K
M
0.015
0.130
0.305
10°
0.38
3.30
7.74
10°
H
J
0.110
0.295
0°
2.80
7.50
0°
G
D 16 PL
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
P DIP 18 = VP
PLASTIC DIP
CASE 707–02
(ML145155VP)
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
18
10
B
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
MILLIMETERS
INCHES
DIM
A
B
C
D
F
MIN
22.22
6.10
3.56
0.36
1.27
MAX
23.24
6.60
4.57
0.56
1.78
MIN
MAX
A
0.875
0.240
0.140
0.014
0.050
0.915
0.260
0.180
0.022
0.070
L
C
G
H
J
K
L
M
N
2.54 BSC
0.100 BSC
1.02
0.20
2.92
1.52
0.30
3.43
0.040
0.008
0.115
0.060
0.012
0.135
K
N
J
F
D
M
SEATING
PLANE
7.62 BSC
0.300 BSC
H
G
0°
15°
0°
15°
0.51
1.02
0.020
0.040
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