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XMC4500 参数 Datasheet PDF下载

XMC4500图片预览
型号: XMC4500
PDF下载: 下载PDF文件 查看货源
内容描述: 微控制器系列为工业应用 [Microcontroller Series for Industrial Applications]
分类和应用: 微控制器
文件页数/大小: 112 页 / 1650 K
品牌: INFINEON [ Infineon ]
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XMC4500  
XMC4000 Family  
Electrical Parameters  
3.3.10.2 EBU Burst Mode Access Timing  
Note: These parameters are not subject to production test, but verified by design and/or  
characterization.  
Note: Operating Conditions apply, with Class A2 pins and CL = 16 pF.  
Table 53  
EBU Burst Mode Read / Write Access Timing Parameters  
Parameter  
Symbol  
Values  
Unit Note /  
Test Condition  
Min. Typ. Max.  
Output delay from BFCLKO t10 CC -2  
rising edge  
2
ns  
ns  
RD and RD/WR  
t12 CC -2  
2
active/inactive after  
BFCLKO active edge1)  
CSx output delay from  
BFCLKO active edge1)  
t21  
t22  
CC -2.5  
CC -2  
1.5  
2
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ADV active/inactive after  
BFCLKO active edge2)  
BAA active/inactive after  
BFCLKO active edge2)  
t22a CC -2.5  
1.5  
Data setup to BFCLKI rising t23  
SR  
SR  
SR  
SR  
3
0
3
0
edge3)  
Data hold from BFCLKI  
rising edge3)  
t24  
WAIT setup (low or high) to t25  
BFCLKI rising edge3)  
WAIT hold (low or high) from t26  
BFCLKI rising edge3)  
1) An active edge can be a rising or falling edge, depending on the settings of bits BFCON.EBSE / ECSE and  
the clock divider ratio.  
Negative minimum values for these parameters mean that the last data read during a burst may be corrupted.  
However, with clock feedback enabled, this value is an oversampling not required for the internal bus  
transaction, and will be discarded.  
2) This parameter is valid for BUSCONx.EBSE = 1 and BUSAPx.EXTCLK = 00B.  
For BUSCONx.EBSE = 1 and other values of BUSAPx.EXTCLK, ADV and BAA will be delayed by 1/2 of the  
internal bus clock period TCPU = 1 / fCPU  
.
For BUSCONx. EBSE = 0 and BUSAPx.EXTCLK = 11B, add 2 internal bus clock periods.  
For BUSCONx. EBSE = 0 and other values of BUSAPx.EXTCLK, add 1 internal bus clock period.  
Data Sheet  
95  
V1.0, 2013-01  
Subject to Agreement on the Use of Product Information  
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