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BTS740S2 参数 Datasheet PDF下载

BTS740S2图片预览
型号: BTS740S2
PDF下载: 下载PDF文件 查看货源
内容描述: 智能高侧电源开关两个渠道: 2× 30mз电流检测 [Smart High-Side Power Switch Two Channels: 2 x 30mз Current Sense]
分类和应用: 开关电源开关
文件页数/大小: 15 页 / 423 K
品牌: INFINEON [ Infineon ]
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®
PROFET BTS 740 S2  
Maximum Ratings at Tj = 25°C unless otherwise specified  
Parameter  
Symbol  
Values  
Unit  
Supply voltage (overvoltage protection see page 5)  
Vbb  
Vbb  
43  
34  
V
Supply voltage for full short circuit protection  
Tj,start =-40 ...+150°C  
V
Load current (Short-circuit current, see page 5)  
IL  
self-limited  
60  
A
V
3)  
Load dump protection1) VLoadDump = VA + Vs, VA = 13.5 V VLoaddump  
RI2) = 2 , td = 200 ms; IN= low or high,  
each channel loaded with RL = 7.0 ,  
Operating temperature range  
Storage temperature range  
Power dissipation (DC)4)  
(all channels active)  
Tj  
-40 ...+150  
-55 ...+150  
°C  
W
Tstg  
Ta = 25°C: Ptot  
Ta = 85°C:  
3.8  
2.0  
Maximal switchable inductance, single pulse  
Vbb =12V, Tj,start =150°C4),  
18  
16  
mH  
kV  
I = 5.5 A, EAS = 370 mJ, 0Ω  
one channel: ZL  
IL = 8.5 A, EAS = 790 mJ, 0Ω  
two parallel channels:  
L
see diagrams on page 10  
Electrostatic discharge capability (ESD)  
(Human Body Model)  
IN: VESD  
ST, IS:  
out to all other pins shorted:  
1.0  
4.0  
8.0  
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993  
R=1.5k; C=100pF  
Input voltage (DC)  
VIN  
-10 ... +16  
V
Current through input pin (DC)  
Current through status pin (DC)  
Current through current sense pin (DC)  
see internal circuit diagram page 9  
IIN  
IST  
IIS  
±2.0  
±5.0  
±14  
mA  
Thermal Characteristics  
Parameter and Conditions  
Symbol  
Values  
typ  
Unit  
min  
--  
Max  
12  
Thermal resistance  
junction - soldering point4),5)  
junction - ambient4)  
each channel: Rthjs  
K/W  
--  
40  
33  
Rthja  
one channel active:  
all channels active:  
--  
--  
--  
--  
1)  
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150Ω  
resistor for the GND connection is recommended.  
2)  
3)  
4)  
R = internal resistance of the load dump test pulse generator  
I
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839  
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for V  
bb  
connection. PCB is vertical without blown air. See page 15  
5)  
Soldering point: upper side of solder edge of device pin 15. See page 15  
Semiconductor Group  
3
2003-Oct-01  
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