Package Characteristics
All specifications and figures are at the nominal (typical) operating conditions of V
= 5 V, V - V = 30 V,
CC2 EE
CC1
V - V = 0 V, and T = +25°C.
E
EE
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Note
Input-Output Momentary
Withstand Voltage
VISO
3750
Vrms
RH < 50%, t = 1 min.,
TA = 25°C
1, 2,
3
Resistance (Input-Output)
Capacitance (Input-Output)
RI-O
>109
1.3
Ω
VI-O = 500 Vdc
f = 1 MHz
3
CI-O
pF
Output IC-to-Pins 9 &10
Thermal Resistance
qO9-10
30
°C/W
TA = 100°C
Input IC-to-Pin 4 Thermal Resistance
qI4
60
Solder Reflow Thermal Profile
300
PREHEATING RATE 3 °C + 1 C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C 0.5 °C/SEC.
PEAK
PEAK
TEMP.
240 °C
TEMP.
245 °C
PEAK
TEMP.
230 °C
200
100
2.5 °C 0.5 °C/SEC.
SOLDERING
TIME
30
160 °C
150 °C
140 °C
SEC.
200 °C
30
SEC.
3 °C + 1 °C/–0.5 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
TIMEWITHIN 5°C of ACTUAL
PEAKTEMPERATURE
t
p
20-40 SEC.
260 +0/-5 °C
T
p
217 °C
T
L
RAMP-UP
3°C/SEC. MAX.
RAMP-DOWN
6°C/SEC. MAX.
150 - 200°C
T
smax
T
smin
25
t
s
t
L
60 to 150 SEC.
PREHEAT
60to180SEC.
t 25°C to PEAK
TIME
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200°C, T = 150°C
T
smax
smin
Note: Non-halide flux should be used.
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
