Chapter 1: Cyclone III Device Data Sheet
1–23
Switching Characteristics
External Memory Interface Specifications
Cyclone III devices support external memory interfaces up to 200 MHz. The external
memory interfaces for Cyclone III devices are auto-calibrating and easy to implement.
f
For more information about external memory system performance specifications,
board design guidelines, timing analysis, simulation, and debugging information,
refer to Literature: External Memory Interfaces.
Table 1–32 lists the FPGA sampling window specifications for Cyclone III devices.
Table 1–32. Cyclone III Devices FPGA Sampling Window (SW) Requirement – Read Side (Note 1)
Column I/Os Row I/Os
Wraparound Mode
Memory Standard
Setup
Hold
Setup
Hold
Setup
Hold
C6
C7
C8
I7
DDR2 SDRAM
580
585
785
550
535
735
690
700
805
640
650
755
850
870
905
800
820
855
DDR SDRAM
QDRII SRAM
DDR2 SDRAM
DDR SDRAM
QDRII SRAM
705
675
900
650
620
845
770
795
910
715
740
855
985
970
930
915
1085
1030
DDR2 SDRAM
DDR SDRAM
QDRII SRAM
785
800
720
740
990
930
915
870
855
1115
1185
1210
1055
1125
1150
1050
1065
1005
DDR2 SDRAM
DDR SDRAM
QDRII SRAM
765
745
945
710
690
890
855
880
955
800
825
900
1040
1000
1130
985
945
1075
A7
DDR2 SDRAM
DDR SDRAM
805
880
745
820
1020
955
960
935
1145
1220
1250
1085
1160
1190
QDRII SRAM
1090
1030
1105
1045
Note to Table 1–32:
(1) Column I/Os refer to top and bottom I/Os. Row I/Os refer to right and left I/Os. Wraparound mode refers to the combination of column and row
I/Os.
© January 2010 Altera Corporation
Cyclone III Device Handbook, Volume 2
ALTERA [ ALTERA CORPORATION ]
