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HDMP-1024 参数 Datasheet PDF下载

HDMP-1024图片预览
型号: HDMP-1024
PDF下载: 下载PDF文件 查看货源
内容描述: 低成本的千兆速率发送/接收芯片组与TTL I / O的 [Low Cost Gigabit Rate Transmit/Receive Chip Set with TTL I/Os]
分类和应用: 电信集成电路电信电路
文件页数/大小: 40 页 / 316 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
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Mechanical Dimensions  
and Surface Mount  
Assembly  
dimensions conform to JEDEC  
plastic QFP specifications and are  
shown below in Figure 10. The  
M-Quad 80 package material is  
aluminum and the leads have  
been formed into a “Gull-Wing”  
configuration for surface  
We recommend keeping the  
package temperature, Tc, below  
75°C. Forced air cooling may be  
required.  
Recommendations  
Both the HDMP-1022 and  
HDMP-1024 are implemented in  
an industry standard M-Quad 80  
package. The package outline  
mounting.  
M-Quad 80 Package Information  
Item  
Details  
Package Material  
Aluminum  
85/15 Sn/Pb  
300 - 600 µ inches  
Lead Finish Material  
Lead Finish Thickness  
Lead Coplanarity  
0.004 inches maximum  
PIN #1 ID  
+0.18  
19.786  
-0.08  
+0.008  
-0.002  
)
(0.779  
TOP VIEW  
23.20 ± 0.10  
(0.913 ± 0.004)  
0.15  
(0.006)  
+0.16  
13.792  
0.35 TYP.  
(0.014 TYP.)  
7 DEG  
-0.04  
+0.008  
(0.543  
)
0.80 TYP.  
(0.032 TYP.)  
-0.002  
0.80 ± 0.13  
(0.031 ± 0.00)  
17.20 ± 0.10  
(0.677 ± 0.004)  
2.64 ± 0.13  
(0.104 ± 0.005)  
0.38 ± 0.05  
(0.015 ± 0.002)  
ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).  
Figure 10. Mechanical Dimensions of HDMP-1022 and HDMP-1024.  
637  
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