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5962-9750701HXC 参数 Datasheet PDF下载

5962-9750701HXC图片预览
型号: 5962-9750701HXC
PDF下载: 下载PDF文件 查看货源
内容描述: 四SHARC DSP多处理器家族 [Quad-SHARC DSP Multiprocessor Family]
分类和应用: 外围集成电路时钟
文件页数/大小: 44 页 / 746 K
品牌: ADI [ ADI ]
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AD14060/AD14060LSPECIFICATIONS  
RECOMMENDED OPERATING CONDITIONS  
B Grade  
Min  
K Grade  
P ar am eter  
Max  
Min  
Max  
Units  
VDD  
Supply Voltage (5 V)  
Supply Voltage (3.3 V)  
Case Operating T emperature  
4.75  
3.15  
–40  
5.25  
3.6  
+100  
4.75  
3.15  
0
5.25  
3.6  
+85  
V
V
°C  
T CASE  
ELECTRICAL CHARACTERISTICS (3.3 V, 5 V SUPPLY)  
Case  
Test  
5 V  
3.3 V  
Min Typ Max  
P ar am eter  
Tem p Level Test Condition  
Min Typ Max  
Units  
VIH1  
VIH2  
VIL  
VOH  
VOL  
IIH  
High Level Input Voltage1  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
Full  
I
I
I
I
I
I
I
I
I
I
I
I
I
I
@ VDD = max  
@ VDD = max  
@ VDD = min  
2.0  
2.2  
VDD + 0.5 2.0  
VDD + 0.5 2.2  
0.8  
2.4  
0.4  
10  
VDD + 0.5  
VDD + 0.5  
0.8  
V
V
V
V
High Level Input Voltage2  
Low Level Input Voltage1, 2  
High Level Output Voltage3, 4  
Low Level Output Voltage3, 4  
High Level Input Current5, 6, 7  
Low Level Input Current5  
@ VDD = min, IOH = –2.0 mA4  
@ VDD = min, IOL = 4.0 mA4  
@ VDD = max, VIN = VDD max  
@ VDD = max, VIN = 0 V  
@ VDD = max, VIN = 0 V  
@ VDD = max, VIN = 0 V  
@ VDD = max, VIN = VDD max  
@ VDD = max, VIN = 0 V  
@ VDD = max, VIN = VDD max  
@ VDD = max, VIN = 0 V  
@ VDD = max, VIN = 1.5 V (5 V),  
2 V (3.3 V)  
4.1  
0.4  
10  
10  
150  
600  
10  
10  
350  
1.5  
V
µA  
µA  
µA  
µA  
µA  
µA  
µA  
mA  
IIL  
IILP  
10  
Low Level Input Current6  
150  
600  
10  
10  
350  
1.5  
IILPX4  
IOZH  
IOZL  
IOZHP  
IOZLC  
IOZLA  
Low Level Input Current7  
T hree-State Leakage Current8, 9, 10, 14  
T hree-State Leakage Current8, 11  
T hree-State Leakage Current11  
T hree-State Leakage Current12  
T hree-State Leakage Current13  
350  
4.2  
150  
600  
350  
4.2  
150  
600  
µA  
mA  
µA  
µA  
A
mA  
pF  
IOZLAR  
IOZLS  
T hree-State Leakage Current10  
T hree-State Leakage Current9  
Full  
Full  
Full  
Full  
Full  
+25°C  
I
I
I
IV  
I
@ VDD = max, VIN = 0 V  
@ VDD = max, VIN = 0 V  
@ VDD = max, VIN = 0 V  
tCK = 25 ns, VDD = max  
VDD = max  
IOZLSX4 T hree-State Leakage Current14  
IDDIN  
IDDIDLE Supply Current (Idle)16  
CIN  
Input Capacitance17, 18  
Supply Current (Internal)15  
1.4 3.4  
800  
1.0 2.2  
760  
V
15  
15  
EXP LANATIO N O F TEST LEVELS  
Test Level  
I
100% Production T ested19  
.
II  
100% Production T ested at +25°C, and Sample T ested at Specified T emperatures.  
III  
IV  
V
Sample T ested Only.  
Parameter is guaranteed by design and analysis, and characterization testing on discrete SHARCs.  
Parameter is typical value only.  
VI  
All devices are 100% production tested at +25°C; sample tested at temperature extremes.  
NOT ES  
1 Applies to input and bidirectional pins: DAT A47-0, ADDR31-0, RD, WR, SW, ACK, SBTS, IRQy2-0, FLAGy0, FLAG1, FLAGy2, HBG, CSy, DMAR1, DMAR2,  
BR6-1, RPBA, CPAy, T FS0, T FSy1, RFS0, RFSy1, LyxDAT 3-0, LyxCLK, LyxACK, EBOOT A, LBOOT A, EBOOT BCD, LBOOT BCD, BMSA, BMSBCD, T MS,  
T DI, T CK, HBR, DR0, DRy1, T CLK0, T CLKy1, RCLK0, RCLKy1.  
2 Applies to input pins: CLKIN, RESET, TRST.  
3 Applies to output and bidirectional pins: DAT A47-0, ADDR31-0, MS3-0 RD, WR, PAGE, ADRCLK, SW, ACK, FLAGy0, FLAG1, FLAGy2, T IMEXPy, HBG,  
REDY, DMAG1, DMAG2, BR6-1, CPAy, DT O, DT y1, T CLK0, T CLKy1, RCLK0, RCLKy1, T FS0, T FSy1, RFS0, RFSy1 LyxDAT 3-0, LyxCLK, LyxACK,  
BMSA, BMSBCD, T DO, EMU.  
4 See Output Drive Currents for typical drive current capabilities.  
5 Applies to input pins: SBTS, IRQy2-0, HBR, CSy, DMAR1, DMAR2, RPBA, EBOOT A, LBOOT A, EBOOT BCD, LBOOT BCD, CLKIN, RESET, T CK.  
6 Applies to input pins with internal pull-ups: DR0, DRy1, T DI.  
7Applies to bussed input pins with internal pull-ups: TRST, T MS.  
8 Applies to three-statable pins: DAT A47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAGy0, FLAG1, FLAGy2, REDY, HBG, DMAG1, DMAG2,  
BMSA, BMSBCD, T DO, EMU. (Note that ACK is pulled up internally with 2 kduring reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-  
2106x is not requesting bus mastership. HBG AND EMU are not tested for leakage current.)  
9 Applies to three-statable pins with internal pull-ups: DT y1, T CLKy1, RCLKy1.  
10 Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 kduring reset in a multiprocessor system, when ID 2-0 = 001 and another  
ADSP-2106x is not requesting bus mastership.)  
11 Applies to three-statable pins with internal pull-downs: LyxDAT 3-0, LyxCLK, LyxACK.  
12 Applies to CPAy pin.  
13 Applies to ACK pin when keeper latch enabled.  
14 Applies to bused three-statable pins with internal pull-ups: DT 0, T CLK0, RCLK0.  
15 Applies to VDD pins. Conditions of operation: each processor executing radix-2 FFT butterfly with instruction in cache, one data operand fetched from each internal  
memory block, and one DMA transfer occurring from/to internal memory at t CK = 25 ns.  
16 Applies to VDD pins. Idle denotes AD14060/AD14060L state during execution of IDLE instruction.  
17 Applies to all signal pins.  
18 Guaranteed but not tested.  
19 Link and Serial Ports: All are 100% tested at die level prior to assembly. All are 100% ac tested at module level; Link-4 and Serial-0 are also dc tested at the module  
level. See T iming Specifications.  
Specifications subject to change without notice.  
REV. A  
–14–  
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