BRIGHT
Microelectronics
Inc.
Preliminary BM29F040
Maximum Overshoot
Maximum Negative Overshoot
20 nS
20 nS
+0.8 V
-0.5 V
20 nS
-2.0 V
Maximum Negative Overshoot Waveform
Vcc + 2.0 V
Vcc + 0.5 V
2.0 V
20 nS
20 nS
20 nS
Maximum positive Overshoot Waveform
Figure 6. Maximum Overshoot Waveforms
DC Characteristics
PARAMETER
Input Low Level
SYM.
VIL
MIN.
-0.5
2.0
MAX.
0.8
UNIT
TEST CONDITIONS
V
V
V
V
V
Input High Level
VIH
Vcc +0.5
0.45
Output Low Voltage
Output High Voltage
Output High Voltage
Input Load Current
Output Leakage Current
VOL
VOH
lOL = 12 mA Vcc = Vcc Min.
lOH = -2.5 mA Vcc = Vcc Min.
lOHl = -100 mA Vcc = Vcc Min.
Vin = Vcc or GND Vcc = Vcc Max.
2.4
VOH2 Vcc -0.4
lLI
+/- 1.0
+/- 10
mA
mA
lLO
Vout = Vcc or GND Vcc = Vcc
Max.
Output Short Circuit Current
lOS
100
100
mA
Vout = 0.5V, Vcc = Vcc Max.
Vcc Standby Current (CMOS) 4
lSB1
mA
CE = Vcc +/- 0.5V, Vcc = Vcc
Max.
Vcc Standby Current (TTL) 4
Vcc Active Current Read 1, 3
Vcc Active Current Program or 2
lSB2
lCC1
lCC2
1.0
40
60
mA
mA
mA
CE = VIH Vcc = Vcc Max.
CE = VIL, f = 6 MHz, CE = VIH
CE = VIL, CE = VIH
A9 Intelligent Identifier Volatge
A9 Intelligent Identifier Current
VID
lID
11.5
12.5
50
V
A9 = VID
mA
Table 9
Notes:
1. All Currents are in RMS unless otherwise noted. Typical values are Vcc = +5.0V, T = 25° C.
2. These parameters are sampled but not 100% tested.
3. Automatic power saving reduces the Iccr to 1 mA.
4. CMOS inputs are Vcc +0.5V. TTL inputs are either VIL or VIH.
A Winbond Company
Publication Release Date: June 1999
Revision A1
- 17 -
WINBOND [ WINBOND ]
