SI-3000LSA Series
■External Dimensions (SOP8)
(Unit : mm)
5.1±0.4
1.27
+0.1
0.4±0.1
0.15
–0.05
Pin Assignment
q VIN
8
1
7
6
3
5
4
w NC (Leave open)
e VIN
r VC
t GND
y GND
2
u VO
i VO
1.27
0.995max.
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.1g
0.10
0.4±0.1
0.12 M
■Block Diagram
VIN
NC
1
2
3
4
8
7
VO
VO
+
–
VIN
VC
TSD
6
5
GND
GND
■Typical Connection Diagram
VIN
VO
1
2
3
4
8
CO: Output capacitor (22 µF or larger)
CIN: Input capacitor (10 µF)
7
6
5
CIN
+
+
This capacitor is required in the case of an inductive input line or long
VIN
wiring.
GND
CO
Tantalum capacitors are recommended for CIN and CO, particularly at
VC
low temperatures.
* Leave pin 2 open.
■Reference Data
PCB Copper Laminate Area vs. Junction to
Ambient Air Thermal Resistance
Allowable Output Current
(vs. VIN-VOUT Voltage Difference)
VIN-IO max
150
1.2
1.0
0.8
0.6
0.4
0.2
0
PCB (glass-epoxy, 40×40mm)
Tj = 120°C (20% derating of 150°C)
140
160mm (40×40) mm
The inner frame stage, on which the PTr is mounted,
is directly connected to the VOUT pin.
Therefore, enlarging the copper laminate area
around the VOUT pin is really effective for a heat
radiation.
130
120
110
100
90
θ
j-a=100°C/W
θ
T
a=25°C
T
a
=85°C
80
70
100
1000
5000
1
2
3
4
)
Copper Laminate Area (mm2
VIN-VOUT Voltage Difference (V)
ICs
69
ETC [ ETC ]
