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DS031 参数 Datasheet PDF下载

DS031图片预览
型号: DS031
PDF下载: 下载PDF文件 查看货源
内容描述: 的Virtex -II FPGA平台:完整的数据表 [Virtex-II Platform FPGAs: Complete Data Sheet]
分类和应用:
文件页数/大小: 318 页 / 2407 K
品牌: XILINX [ XILINX, INC ]
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Virtex-II Platform FPGAs: DC and Switching Characteristics  
4. Record the time to V  
.
Output Delay Measurements  
MEAS  
5. Compare the results of steps 2 and 4. The increase or  
decrease in delay should be added to or subtracted  
from the I/O Output Standard Adjustment value  
(Table 17) to yield the actual worst-case propagation  
delay (clock-to-input) of the PCB trace.  
Output delays are measured using a Tektronix P6245  
TDS500/600 probe (< 1 pF) across approximately 4" of FR4  
microstrip trace. Standard termination was used for all test-  
ing. (See Virtex-II Platform FPGA User Guide for details.)  
The propagation delay of the 4" trace is characterized sep-  
arately and subtracted from the final measurement, and is  
therefore not included in the generalized test setup shown in  
Figure 1.  
VREF  
Measurements and test conditions are reflected in the IBIS  
models except where the IBIS format precludes it. (IBIS  
models can be found on the web at http://support.xil-  
FPGA Output  
RREF  
inx.com/support/sw_ibis.htm.) Parameters V  
, R  
,
REF  
REF  
C
, and V  
fully describe the test conditions for each  
REF  
MEAS  
VMEAS  
I/O standard. The most accurate prediction of propagation  
delay in any given application can be obtained through IBIS  
simulation, using the following method:  
(voltage level at which  
delay measurement is taken)  
CREF  
(probe capacitance)  
1. Simulate the output driver of choice into the generalized  
test setup, using values from Table 19.  
ds083-3_06a_092503  
2. Record the time to V  
.
MEAS  
Figure 1: Generalized Test Setup  
3. Simulate the output driver of choice into the actual PCB  
trace and load, using the appropriate IBIS model or  
capacitance value to represent the load.  
Table 19: Output Delay Measurement Methodology  
(1)  
IOSTANDARD  
Attribute  
RREF CREF  
VMEAS VREF  
Description  
LVTTL (Low-Voltage Transistor-Transistor Logic)  
LVCMOS (Low-Voltage CMOS ), 3.3V  
LVCMOS, 2.5V  
(Ω)  
1M  
1M  
1M  
1M  
1M  
25  
25  
25  
25  
25  
25  
25  
25  
50  
25  
50  
25  
50  
25  
50  
25  
(pF)  
(V)  
(V)  
LVTTL (all)  
LVCMOS33  
0
1.4  
0
0
1.65  
1.25  
0.9  
0
LVCMOS25  
0
0
LVCMOS, 1.8V  
LVCMOS18  
0
0
LVCMOS, 1.5V  
LVCMOS15  
0
0.75  
0.94  
2.03  
0.94  
2.03  
0.94  
2.03  
0.8  
0
PCI33_3 (rising edge)  
PCI33_3 (falling edge)  
PCI66_3 (rising edge)  
PCI66_3 (falling edge)  
PCIX (rising edge)  
PCIX (falling edge  
GTL  
10(2)  
0
PCI (Peripheral Component Interface), 33 MHz, 3.3V  
PCI, 66 MHz, 3.3V  
10(2)  
3.3  
0
10(2)  
10(2)  
3.3  
10(3)  
PCI-X, 133 MHz, 3.3V  
10(3)  
3.3  
1.2  
1.5  
0.75  
0.75  
1.5  
1.5  
0.9  
0.9  
1.8  
1.8  
GTL (Gunning Transceiver Logic)  
GTL Plus  
0
0
0
0
0
0
0
0
0
0
GTLP  
1.0  
HSTL (High-Speed Transceiver Logic), Class I  
HSTL, Class II  
HSTL_I  
VREF  
VREF  
0.9  
HSTL_II  
HSTL, Class III  
HSTL_III  
HSTL, Class IV  
HSTL_IV  
0.9  
HSTL, Class I, 1.8V  
HSTL, Class II, 1.8V  
HSTL, Class III, 1.8V  
HSTL, Class IV, 1.8V  
HSTL_I_18  
VREF  
VREF  
1.1  
HSTL_II_18  
HSTL_III_18  
HSTL_IV_18  
1.1  
DS031-3 (v3.5) November 5, 2007  
Product Specification  
www.xilinx.com  
Module 3 of 4  
18  
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