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TMC6200 参数 Datasheet PDF下载

TMC6200图片预览
型号: TMC6200
PDF下载: 下载PDF文件 查看货源
内容描述: [Universal high voltage BLDC/PMSM/Servo MOSFET 3-halfbridge gate-driver with in line motor current sensing.]
分类和应用:
文件页数/大小: 44 页 / 1548 K
品牌: TRINAMIC [ TRINAMIC MOTION CONTROL GMBH & CO. KG. ]
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TMC6200 DATASHEET (Rev. 1.01 / 2018-NOV-15)  
9
Pin  
TQFP  
Type Function  
Charge pump capacitor input. Tie to CPO using 22nF 100V  
capacitor. In case ringing of the power supply leads to  
considerable supply ripple, add a 10-22Ohm series resistor.  
Motor supply voltage. Provide filtering capacity near pin with  
short loop to GND plane. Must be tied to the positive bridge  
supply voltage. Severe ringing must be avoided.  
Charge pump voltage. Tie to VS using 100nF capacitor.  
Bootstrap capacitor positive connection. Tie to W terminal  
using 470nF to 1µF, 16V or 25V ceramic capacitor.  
High side gate driver output.  
CPI  
32  
VS  
33  
VCP  
CW  
HSW  
W
34  
36  
37  
38  
Bridge center and bootstrap capacitor negative connection.  
Connect to source pin of HS-MOSFET.  
Sense resistor connection for phase W. Connect to the motor  
side of the sense resistor. A 10Ω to 22Ω protection resistor is  
recommended. Directly connect to W, in case no sense resistor  
is used.  
Sense resistor connection for phase V. Connect to the motor  
side of the sense resistor. A 10Ω to 22Ω protection resistor is  
recommended. Directly connect to V, in case no sense resistor  
is used.  
WSENSE  
VSENSE  
39  
41  
AI  
AI  
Bridge center and bootstrap capacitor negative connection.  
Connect to source pin of HS-MOSFET.  
High side gate driver output.  
Bootstrap capacitor positive connection. Tie to V terminal  
using 470nF to 1µF, 16V or 25V ceramic capacitor.  
Sense resistor connection for phase U. Connect to the motor  
side of the sense resistor. A 10Ω to 22Ω protection resistor is  
recommended. Directly connect to U, in case no sense resistor  
is used.  
V
42  
43  
44  
HSV  
CV  
USENSE  
46  
AI  
Bridge center and bootstrap capacitor negative connection.  
Connect to source pin of HS-MOSFET.  
High side gate driver output.  
U
47  
48  
HSU  
Connect the exposed die pad to a GND plane. Provide as many  
as possible vias for heat transfer to GND plane. Serves as GND  
pin for the low side gate drivers and for digital logic. Ensure  
low loop inductivity to sense resistor GND.  
Exposed die  
pad  
-
*(pd) denominates a pin with pulldown resistor  
www.trinamic.com  
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