TMC6200 DATASHEET (Rev. 1.01 / 2018-NOV-15)
7
2 Pin Assignments
2.1 Package Outline
36
35
34
33
32
31
30
29
28
27
26
25
1
CU
CW
2
3
GNDP
GNDP
LSW
LSV
VCP
VS
4
Bernhard Dwersteg, TRINAMIC
5
LSU
CPI
6
TMC6200-TA
TQFP-48
12VOUT
5VOUT
GNDA
7
CPO
VSA
8
9
CURU
10
11
12
CURV
DRV_EN
FAULT
SPE
PAD = GNDP, GNDD
CURW
VOFS/TEST
Figure 2.1 TMC6200-TA package and pinning TQFP-EP 48 (7x7mm² body, 9x9mm² with leads)
2.2 Signal Descriptions
Pin
TQFP
Type Function
Bootstrap capacitor positive connection. Tie to U terminal
using 470nF to 1µF, 16V or 25V ceramic capacitor.
Unused pins for increased creeping distances.
CU
1
2, 28, 31,
35, 40, 45
–
N.C.
LSW
LSV
3
4
Low side gate driver output.
Low side gate driver output.
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