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UCC21759QDWRQ1 参数 Datasheet PDF下载

UCC21759QDWRQ1图片预览
型号: UCC21759QDWRQ1
PDF下载: 下载PDF文件 查看货源
内容描述: [适用于 IGBT/SiC MOSFET 且具有 DESAT 和内部钳位的汽车类 3.0kVrms、±10A 单通道隔离式栅极驱动器 | DW | 16 | -40 to 150]
分类和应用: 栅极驱动双极性晶体管驱动器
文件页数/大小: 57 页 / 2481 K
品牌: TI [ TEXAS INSTRUMENTS ]
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UCC21759-Q1  
SLUSEB4A – AUGUST 2020 – REVISED DECEMBER 2020  
www.ti.com  
6.7 Safety-Related Certifications  
VDE  
UL  
Plan to certify according to DIN V VDE V 0884-11 (VDE V 0884-11):2017-01;  
DIN EN 61010-1 (VDE 0411-1):2011-07  
Plan to certify according to UL 1577 Component  
Recognition Program  
Maximum transient isolation voltage, 4242 VPK  
;
Maximum repetitive peak isolation voltage, 990 VPK  
Maximum surge isolation voltage, 6000 VPK  
;
Single protection, 3000 VRMS  
Certification Planned  
Certification Planned  
6.8 Safety Limiting Values  
Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure  
of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat  
the die and damage the isolation barrier, potentially leading to secondary system failures.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
RθJA =68.3°C/W, VDD = 15V, VEE=-5V, TJ = 150°C, TA =  
25°C  
61  
Safety input, output, or supply  
current  
IS  
mA  
49  
RθJA =68.3°C/W, VDD = 20V, VEE=-5V, TJ = 150°C, TA =  
25°C  
RθJA =68.3°C/W, VDD = 20V, VEE=-5V, TJ = 150°C, TA =  
25°C  
PS  
TS  
Safety input, output, or total power  
Safety temperature  
1220  
150  
mW  
°C  
(1) The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-  
air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-  
to-air thermal resistance in the Section 6.4 table is that of a device installed on a high-K test board for leaded surface-mount packages.  
The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature  
plus the power times the junction-to-air thermal resistance.  
Copyright © 2020 Texas Instruments Incorporated  
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