UCC21759-Q1
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UNIT
SLUSEB4A – AUGUST 2020 – REVISED DECEMBER 2020
6.4 Thermal Information
DW (SOIC)
16
THERMAL METRIC(1)
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
68.3
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
27.5
32.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
14.1
ψJB
32.3
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Power Ratings
PARAMETER
TEST CONDITIONS
Value
UNIT
PD
Maximum power dissipation (both sides)
985
mW
Maximum power dissipation by
transmitter side
PD1
VCC = 5V, VDD-COM = 20V, COM-VEE = 5V, IN+/- = 5V, 150kHz,
50% Duty Cycle for 10nF load, Ta=25oC
20
mW
mW
Maximum power dissipation by receiver
side
PD2
965
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