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LM5116 参数 Datasheet PDF下载

LM5116图片预览
型号: LM5116
PDF下载: 下载PDF文件 查看货源
内容描述: LM5116宽范围同步降压控制器 [LM5116 Wide Range Synchronous Buck Controller]
分类和应用: 控制器
文件页数/大小: 37 页 / 1452 K
品牌: TI [ TEXAS INSTRUMENTS ]
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LM5116  
www.ti.com  
SNVS499G FEBRUARY 2007REVISED MARCH 2013  
desired compensation network zero 1 / (2π x RCOMP x CCOMP) to be 2.5 kHz. Increasing RCOMP, while  
proportionally decreasing CCOMP, increases the error amp gain. Conversely, decreasing RCOMP while  
proportionally increasing CCOMP, decreases the error amp gain. For the design example CCOMP was selected as  
3300 pF and RCOMP was selected as 18 k. These values configure the compensation network zero at 2.7 kHz.  
The error amp gain at frequencies greater than fZEA is: RCOMP / RFB2, which is approximately 4.8 (13.6 dB).  
Figure 37. Error Amplifier Gain and Phase  
The overall voltage loop gain can be predicted as the sum (in dB) of the modulator gain and the error amp gain.  
Figure 38. Overall Voltage Loop Gain and Phase  
If a network analyzer is available, the modulator gain can be measured and the error amplifier gain can be  
configured for the desired loop transfer function. If a network analyzer is not available, the error amplifier  
compensation components can be designed with the guidelines given. Step load transient tests can be  
performed to verify acceptable performance. The step load goal is minimum overshoot with a damped response.  
CHF can be added to the compensation network to decrease noise susceptibility of the error amplifier. The value  
of CHF must be sufficiently small since the addition of this capacitor adds a pole in the error amplifier transfer  
function. This pole must be well beyond the loop crossover frequency. A good approximation of the location of  
the pole added by CHF is: fP2 = fZEA x CCOMP / CHF. The value of CHF was selected as 100 pF for the design  
example.  
PCB LAYOUT AND THERMAL CONSIDERATIONS  
In a buck regulator the primary switching loop consists of the input capacitor, MOSFETs and current sense  
resistor. Minimizing the area of this loop reduces the stray inductance and minimizes noise and possible erratic  
operation. The input capacitor should be placed as close as possible to the MOSFETs, with the VIN side of the  
capacitor connected directly to the high-side MOSFET drain, and the GND side of the capacitor connected as  
close as possible to the low-side source or current sense resistor ground connection. A ground plane in the PC  
Copyright © 2007–2013, Texas Instruments Incorporated  
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