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SPRS717F –OCTOBER 2011–REVISED APRIL 2013
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5.6.2.3.3.4 Placement
Figure 5-50 shows the required placement for the AM335x device as well as the DDR3 devices. The
dimensions for this figure are defined in Table 5-61. The placement does not restrict the side of the PCB
on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space.
X1
X2
DDR3
Interface
Y
Figure 5-50. Placement Specifications
Table 5-61. Placement Specifications(1)
NO.
1
PARAMETER
MIN
MAX
1000
600
UNIT
mils
mils
mils
w
X1(2)(3)(4)
X2(2)(3)
Y Offset(2)(3)(4)
2
3
1500
4
Clearance from non-DDR3 signal to DDR3 keepout region(5)(6)
4
(1) DDR3 keepout region to encompass entire DDR3 routing area.
(2) For dimension definitions, see Figure 5-50.
(3) Measurements from center of AM335x device to center of DDR3 device.
(4) Minimizing X1 and Y improves timing margins.
(5) w is defined as the signal trace width.
(6) Non-DDR3 signals allowed within DDR3 keepout region provided they are separated from DDR3 routing layers by a ground plane.
176
Peripheral Information and Timings
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