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AM3352BZCZD80 参数 Datasheet PDF下载

AM3352BZCZD80图片预览
型号: AM3352BZCZD80
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内容描述: 的Sitara AM335x ARM Cortex-A8的微处理器(MPU ) [Sitara AM335x ARM Cortex-A8 Microprocessors (MPUs)]
分类和应用: 微控制器和处理器外围集成电路微处理器时钟
文件页数/大小: 236 页 / 2887 K
品牌: TI [ TEXAS INSTRUMENTS ]
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AM3359, AM3358, AM3357  
AM3356, AM3354, AM3352  
SPRS717F OCTOBER 2011REVISED APRIL 2013  
www.ti.com  
5.6.2.3 DDR3 and DDR3L Routing Guidelines  
NOTE  
All references to DDR3 in this section apply to DDR3 and DDR3L devices, unless otherwise  
noted.  
5.6.2.3.1 Board Designs  
TI only supports board designs utilizing DDR3 memory that follow the guidelines in this document. The  
switching characteristics and timing diagram for the DDR3 memory interface are shown in Table 5-56 and  
Figure 5-46.  
Table 5-56. Switching Characteristics for DDR3 Memory Interface  
NO.  
PARAMETER  
MIN  
MAX  
UNIT  
tc(DDR_CK)  
tc(DDR_CKn)  
1
Cycle time, DDR_CK and DDR_CKn  
2.5  
3.3(1)  
ns  
(1) The JEDEC JESD79-3F Standard defines the maximum clock period of 3.3 ns for all standard-speed bin DDR3 and DDR3L memory  
devices. Therefore, all standard-speed bin DDR3 and DDR3L memory devices are required to operate at 303 MHz.  
1
DDR_CK  
DDR_CKn  
Figure 5-46. DDR3 Memory Interface Clock Timing  
5.6.2.3.1.1 DDR3 versus DDR2  
This specification only covers AM335x PCB designs that utilize DDR3 memory. Designs using DDR2  
memory should use the DDR2 routing guidleines described in Section 5.6.2.2. While similar, the two  
memory systems have different requirements. It is currently not possible to design one PCB that meets  
the requirements of both DDR2 and DDR3.  
5.6.2.3.2 DDR3 Device Combinations  
Since there are several possible combinations of device counts and single-side or dual-side mounting,  
Table 5-57 summarizes the supported device configurations.  
Table 5-57. Supported DDR3 Device Combinations  
NUMBER OF DDR3 DEVICES  
DDR3 DEVICE WIDTH (BITS)  
MIRRORED?  
DDR3 EMIF WIDTH (BITS)  
1
2
16  
8
N
Y(1)  
16  
16  
(1) Two DDR3 devices are mirrored when one device is placed on the top of the board and the second device is placed on the bottom of  
the board.  
170  
Peripheral Information and Timings  
Copyright © 2011–2013, Texas Instruments Incorporated  
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Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352  
 
 
 
 
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