SiI 1161 PanelLink Receiver
Data Sheet
Dimensions and Marking
100-pin TQFP Package Dimensions and Marking Specification
JEDEC Package Code
MS026-AED-HD
L1
typ
max
1.20
0.15
1.05
Thickness
A
A1
A2
D1
E1
F1
G1
L1
b
Stand-off
0.10
1.00
Body Thickness
Body Size
TMDS™
14.00
14.00
16.00
16.00
1.00
E1
F1
Body Size
Footprint
SiI1161CTU
LLLLLL.LLLL
YYWW
Device#
Lot#
DateCode
RevisionCode
Footprint
Lead Length
Lead Width
Lead Thickness
Lead Pitch
TTTTTTmm
0.20
0.20
Pin1
c
Designator
0.50
e
Dimensions in millimeters.
Overall thickness A=A1+A2.
D1
G1
c
A
2
Device
Standard
Pb-free
Device Number
SiI1161CT100
A
1
SiI1161CTU
b
e
Legend
Description
LLLLLL.LLLL Lot Number
YY
Year of Mfr
WW
Week of Mfr
Trace Code
Maturity Code
TTTTTT
mm
0: engineering samples
=1: pre-production
>1: production
Figure 32. Package Diagram
Note: The marking specification for the SiI-1161 was updated January 1, 2004. Please refer to Product Change
Notice (SiI-PC-0044) “Marking standard for 1161 and 1151”, for information on SiI-1161 parts manufactured prior
to December 31, 2003. SiI-PC-0044 covers parts with Date Codes of 0301 through 0352.
Ordering Information
Standard Part Number:
Pb-free Part Number:
SiI1161CT100
SiI1161CTU (‘U’ designates universal lead-free packaging)
Note: All Silicon Image Pb-free (Universal) packages are also rated for the standard Sn/Pb reflow process. Please
refer to the document (SiI-CM-0058) “Reflow Temperature Profile of Standard Leaded and Lead-free or Green
Packages”, for more details.
41
SiI-DS-0096-D
SILICONIMAGE [ Silicon image ]
