LOW CURRENT CONSUMPTION HIGH RIPPLE-REJECTION LOW DROPOUT CMOS VOLTAGE REGULATOR
Rev.2.3_01
S-1312 Series
Power Dissipation of HSNT-4 (1010) and HSNT-4 (0808) (Reference)
Power dissipation of package differs depending on the mounting conditions.
Consider the power dissipation characteristics under the following conditions as reference.
[Mounted board]
(1) Board size:
40 mm × 40 mm × t0.8 mm
Glass epoxy resin (four layers)
50%
When mounted on board (wind speed: 0 m/s)
Refer to the recommended land pattern
(2) Board material:
(3) Wiring ratio:
(4) Test conditions:
(5) Land pattern:
Drawing code: PL004-A-L-SD (HSNT-4 (1010)), PK004-A-L-SD (HSNT-4 (0808))
1200
HSNT-4 (1010)
1000
HSNT-4 (0808)
800
600
400
200
0
100
150
50
0
Ambient Temperature (Ta) [°C]
Figure 9 Power Dissipation of Package (When Mounted on Board)
Table 11
Condition
Power Dissipation (Reference)
Thermal Resistance Value (θj−a)
HSNT-4 (1010)
(When mounted on board)
HSNT-4 (0808)
870 mW
115°C/W
850 mW
117°C/W
(When mounted on board)
11
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