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KFG1216U2B-SIB6 参数 Datasheet PDF下载

KFG1216U2B-SIB6图片预览
型号: KFG1216U2B-SIB6
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 32MX16, 70ns, PBGA67]
分类和应用: 内存集成电路
文件页数/大小: 120 页 / 1551 K
品牌: SAMSUNG [ SAMSUNG ]
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OneNAND512Mb(KFG1216U2B-xIB6)  
FLASH MEMORY  
3.3.1 Cold Reset Mode Operation  
See Timing Diagram 6.13  
At system power-up, the voltage detector in the device detects the rising edge of Vcc and releases an internal power-up reset signal.  
This triggers bootcode loading. Bootcode loading means that the boot loader in the device copies designated sized data (1KB) from  
the beginning of memory into the BootRAM. This sequence is the Cold Reset of OneNAND.  
Boot code copy operation activates after 400us from the moment that Vcc reaches 2.5V.  
The system power must be kept at operating voltage (Refer to 4.2) once it reaches 2.7V.  
It takes approximately 70us to copy 1KB of bootcode. Upon completion of loading into the BootRAM, it is available to be read by the  
host. The INT pin is not available until after IOBE = 1 and IOBE bit can be changed by host.  
3.3.2 Warm Reset Mode Operation  
See Timing Diagrams 6.14  
A Warm Reset means that the host resets the device by using the RP pin. When the a RP low is issued, the device logic stops all cur-  
rent operations and executes internal reset operation and resets current NAND Flash core operation synchronized with the  
falling edge of RP.  
During an Internal Reset Operation, the device initializes internal registers and makes output signals go to default status.  
The BufferRAM data is kept unchanged after Warm/Hot reset operations.  
The device guarantees the logic reset operation in case RP pulse is longer than tRP min(200ns).  
The device may reset if tRP < tRP min(200ns), but this is not guaranteed.  
Warm reset will abort the current NAND Flash core operation. During a warm reset, the content of memory cells being altered is no  
longer valid as the data will be partially programmed or erased.  
Warm reset has no effect on contents of BootRAM and DataRAM.  
3.3.3 Hot Reset Mode Operation  
See Timing Diagram 6.15  
A Hot Reset means that the host resets the device by Reset command. The reset command can be either Command based or  
Register Based. Upon receiving the Reset command, the device logic stops all current operation and executes an internal reset  
operation and resets the current NAND Flash core operation.  
During an Internal Reset Operation, the device initializes internal registers and makes output signals go to default status. The  
BufferRAM data is kept unchanged after Warm/Hot reset operations.  
Hot reset has no effect on contents of BootRAM and DataRAM.  
3.3.4 NAND Flash Core Reset Mode Operation  
See Timing Diagram 6.16  
The Host can reset the NAND Flash Core operation by issuing a NAND Flash Core reset command. NAND Flash core reset will  
abort the current NAND Flash core operation. During a NAND Flash core reset, the content of memory cells being altered is no longer  
valid as the data will be partially programmed or erased.  
NAND Flash Core Reset has an effect on neither contents of BootRAM and DataRAM nor register values.  
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