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K4B2G0846D-HYH9 参数 Datasheet PDF下载

K4B2G0846D-HYH9图片预览
型号: K4B2G0846D-HYH9
PDF下载: 下载PDF文件 查看货源
内容描述: 2GB D-死DDR3L SDRAM [2Gb D-die DDR3L SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 64 页 / 1744 K
品牌: SAMSUNG [ SAMSUNG ]
 浏览型号K4B2G0846D-HYH9的Datasheet PDF文件第45页浏览型号K4B2G0846D-HYH9的Datasheet PDF文件第46页浏览型号K4B2G0846D-HYH9的Datasheet PDF文件第47页浏览型号K4B2G0846D-HYH9的Datasheet PDF文件第48页浏览型号K4B2G0846D-HYH9的Datasheet PDF文件第50页浏览型号K4B2G0846D-HYH9的Datasheet PDF文件第51页浏览型号K4B2G0846D-HYH9的Datasheet PDF文件第52页浏览型号K4B2G0846D-HYH9的Datasheet PDF文件第53页  
Rev. 1.01  
K4B2G0446D  
K4B2G0846D  
datasheet  
DDR3L SDRAM  
[ Table 49 ] Timing Parameters by Speed Bin (Cont.)  
Speed  
DDR3-800  
DDR3-1066  
DDR3-1333  
DDR3-1600  
Units  
NOTE  
Parameter  
Symbol  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
Data Strobe Timing  
DQS, DQS differential READ Preamble  
DQS, DQS differential READ Postamble  
DQS, DQS differential output high time  
DQS, DQS differential output low time  
DQS, DQS differential WRITE Preamble  
DQS, DQS differential WRITE Postamble  
tRPRE  
tRPST  
tQSH  
0.9  
0.3  
Note 19  
0.9  
0.3  
Note 19  
0.9  
0.3  
0.4  
0.4  
0.9  
0.3  
Note 19  
0.9  
0.3  
0.4  
0.4  
0.9  
0.3  
Note 19  
tCK  
tCK  
13, 19, g  
11, 13, b  
13, g  
Note 11  
Note 11  
Note 11  
Note 11  
0.38  
0.38  
0.9  
-
-
-
-
0.38  
0.38  
0.9  
-
-
-
-
-
-
-
-
-
-
-
-
tCK(avg)  
tCK(avg)  
tCK  
tQSL  
13, g  
tWPRE  
tWPST  
0.3  
0.3  
tCK  
DQS, DQS rising edge output access time from rising  
CK, CK  
tDQSCK  
tLZ(DQS)  
tHZ(DQS)  
-400  
-800  
-
400  
400  
400  
-300  
-600  
-
300  
300  
300  
-255  
-500  
-
255  
250  
250  
-225  
-450  
-
225  
225  
225  
ps  
ps  
ps  
13,f  
DQS, DQS low-impedance time (Referenced from RL-  
1)  
13,14,f  
12,13,14  
DQS, DQS high-impedance time (Referenced from  
RL+BL/2)  
DQS, DQS differential input low pulse width  
DQS, DQS differential input high pulse width  
DQS, DQS rising edge to CK, CK rising edge  
DQS,DQS falling edge setup time to CK, CK rising edge  
DQS,DQS falling edge hold time to CK, CK rising edge  
Command and Address Timing  
tDQSL  
tDQSH  
tDQSS  
tDSS  
0.45  
0.45  
-0.25  
0.2  
0.55  
0.55  
0.25  
-
0.45  
0.45  
-0.25  
0.2  
0.55  
0.55  
0.25  
-
0.45  
0.45  
-0.25  
0.2  
0.55  
0.55  
0.25  
-
0.45  
0.45  
-0.27  
0.18  
0.18  
0.55  
0.55  
0.27  
-
tCK  
29, 31  
30, 31  
c
tCK  
tCK(avg)  
tCK(avg)  
tCK(avg)  
c, 32  
c, 32  
tDSH  
0.2  
-
0.2  
-
0.2  
-
-
DLL locking time  
tDLLK  
tRTP  
512  
-
-
512  
-
-
512  
-
-
512  
-
-
nCK  
internal READ Command to PRECHARGE Command  
delay  
max  
max  
max  
max  
e
(4nCK,7.5ns)  
(4nCK,7.5ns)  
(4nCK,7.5ns)  
(4nCK,7.5ns)  
Delay from start of internal write transaction to internal  
read command  
max  
max  
max  
max  
tWTR  
-
-
-
-
e,18  
e
(4nCK,7.5ns)  
(4nCK,7.5ns)  
(4nCK,7.5ns)  
(4nCK,7.5ns)  
WRITE recovery time  
tWR  
15  
4
-
-
15  
4
-
-
15  
4
-
-
15  
4
-
-
ns  
Mode Register Set command cycle time  
tMRD  
nCK  
max  
max  
max  
max  
Mode Register Set command update delay  
tMOD  
-
-
-
-
-
-
-
(12nCK,15ns)  
(12nCK,15ns)  
(12nCK,15ns)  
(12nCK,15ns)  
CAS# to CAS# command delay  
tCCD  
tDAL(min)  
tMPRR  
tRAS  
4
4
-
4
4
nCK  
nCK  
nCK  
ns  
Auto precharge write recovery + precharge time  
Multi-Purpose Register Recovery Time  
ACTIVE to PRECHARGE command period  
WR + roundup (tRP / tCK(AVG))  
1
-
1
-
1
-
1
-
22  
e
See “Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin”  
max  
max  
max  
max  
ACTIVE to ACTIVE command period for 1KB page size  
ACTIVE to ACTIVE command period for 2KB page size  
tRRD  
tRRD  
-
-
-
-
-
-
-
-
e
e
(4nCK,10ns)  
(4nCK,7.5ns)  
(4nCK,6ns)  
(4nCK,6ns)  
max  
max  
max  
max  
(4nCK,10ns)  
(4nCK,10ns)  
(4nCK,7.5ns)  
(4nCK,7.5ns)  
Four activate window for 1KB page size  
Four activate window for 2KB page size  
tFAW  
tFAW  
40  
50  
-
-
37.5  
50  
-
-
30  
45  
-
-
30  
40  
-
-
ns  
ns  
e
e
1.35V  
tIS(base)  
AC160  
215  
200  
285  
275  
365  
140  
125  
210  
200  
290  
80  
1.5V  
65  
-
-
-
60  
45  
-
-
-
-
-
ps  
ps  
ps  
ps  
ps  
b,16  
b,16  
-
-
-
-
-
-
Command and Address setup time to CK, CK refer-  
enced to V (AC) / V (AC) levels  
IH  
IL  
tIS(base)  
AC175  
1.35V  
150  
tIH(base)  
DC90  
130  
120  
185  
b,16  
Command and Address hold time from CK, CK refer-  
enced to V (AC) / V (AC) levels  
IH  
IL  
1.5V  
140  
tIH(base)  
DC100  
b,16  
1.35V  
205  
tIS(base)  
AC135  
-
b,16,27  
-
-
Command and Address setup time to CK, CK refer-  
enced to V (AC) / V (AC) levels  
IH  
IL  
1.5V  
190  
tIS(base)  
AC150  
350  
900  
275  
780  
-
-
170  
560  
-
-
ps  
ps  
b,16,27  
28  
-
-
-
-
Control & Address Input pulse width for each input  
Calibration Timing  
tIPW  
620  
Power-up and RESET calibration time  
Normal operation Full calibration time  
Normal operation short calibration time  
tZQinitI  
tZQoper  
tZQCS  
512  
256  
64  
-
-
-
512  
256  
64  
-
-
-
512  
256  
64  
-
-
-
512  
256  
64  
-
-
-
nCK  
nCK  
nCK  
23  
- 49 -  
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