HYB18H512321AF
512-Mbit GDDR3
Package
6.2
Package Thermal Characteristics
Table 40
PG-TFBGA 136 Package Thermal Resistances
Theta_jA
Theta_jB Theta_jC
JEDEC Board
Air Flow
K/W
1s0p
0 m/s
40
2s0p
0 m/s
22
1 m/s
32
3 m/s
27
1 m/s
19
3 m/s
17
-
5
-
2
1. Theta_jA : Junction to Ambient thermal resistance. The values have been obtained by simulation using the
conditions stated in the JEDEC JESD-51 standard.
2. Theta_jB : Junction to Board thermal resistance. The value has been obtained by simulation.
3. Theta_jC : Junction to Case thermal resistance. The value has been obtained by simulation.
Data Sheet
99
Rev. 1.73, 2005-08
05122004-B1L1-JEN8
QIMONDA [ QIMONDA AG ]
