PCF8574; PCF8574A
NXP Semiconductors
Remote 8-bit I/O expander for I2C-bus with interrupt
Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
Packages offered: DIP16, SO16, SSOP20
3. Applications
LED signs and displays
Servers
Key pads
Industrial control
Medical equipment
PLC
Cellular telephones
Mobile devices
Gaming machines
Instrumentation and test measurement
4. Ordering information
Table 1.
Ordering information
Type number
Topside mark
Package
Name
Description
Version
PCF8574P
PCF8574P
PCF8574AP
PCF8574T
PCF8574AT
8574TS
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
PCF8574AP
PCF8574T/3
PCF8574AT/3
PCF8574TS/3
SO16
plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
SSOP20 plastic shrink small outline package; 20 leads;
body width 4.4 mm
SOT266-1
PCF8574ATS/3 8574A
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
Package Packing method
Minimum Temperature range
part number
order
quantity
PCF8574P
PCF8574AP
PCF8574T/3
PCF8574P,112
PCF8574AP,112
PCF8574T/3,512
PCF8574T/3,518
DIP16
DIP16
SO16
SO16
Standard marking
* IC’s tube - DSC bulk pack
1000
1000
1920
1000
1920
1000
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Standard marking
* IC’s tube - DSC bulk pack
Standard marking
* tube dry pack
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Reel 13” Q1/T1
*standard mark SMD dry pack
PCF8574AT/3
PCF8574AT/3,512 SO16
PCF8574AT/3,518 SO16
Standard marking
* tube dry pack
Tamb = 40 C to +85 C
Reel 13” Q1/T1
Tamb = 40 C to +85 C
*standard mark SMD dry pack
PCF8574_PCF8574A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 27 May 2013
2 of 33
NXP [ NXP ]
