Philips Semiconductors
Product specification
Economy Autosync Deflection Controller
(EASDC)
TDA4858
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground.
SYMBOL
VCC
PARAMETER
MIN.
−0.5
MAX.
+16
UNIT
supply voltage
input voltages
BIN
V
VI(n)
−0.5
−0.5
−0.5
−0.5
+6.0
+6.5
+8.0
+16
V
V
V
V
HSYNC, VPOS, VAMP, VSCOR, VREF, HREF and HPOS
XRAY
CLSEL
VO(n)
output voltages
VOUT1 and VOUT2
−0.5
−0.5
+6.5
+16
V
V
BDRV and HDRV
VI/O(n)
input/output voltages
BOP and BSENS
−0.5
−0.5
−
+6.0
+6.5
100
+10
−10
1
V
V
VSYNC
IHDRV
IHFLB
ICLBL
IBOP
IBDRV
IEWDRV
Tamb
Tj
horizontal driver output current
horizontal flyback input current
video clamping pulse/vertical blanking output current
B+ control OTA output current
B+ control driver output current
EW driver output current
operating ambient temperature
junction temperature
mA
mA
mA
mA
mA
mA
°C
−10
−
−
−
50
−
−5
0
70
−
150
+150
°C
Tstg
storage temperature
−55
°C
Vesd
electrostatic discharge for all pins (note 1)
machine model
−400
+400
V
V
human body model
−3000
+3000
Note
1. Machine model: 200 pF, 25 Ω, 2.5 µH; human body model: 100 pF, 1500 Ω, 7.5 µH.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
55
UNIT
K/W
Rth j-a
thermal resistance from junction to ambient in free air
QUALITY SPECIFICATION
In accordance with “URF-4-2-59/601”; EMC emission/immunity test in accordance with “DIS 1000 4.6” (IEC 801.6)
SYMBOL
PARAMETER
emission test
immunity test
CONDITIONS
note 1
note 1
MIN.
TYP.
MAX.
UNIT
mV
VEMC
−
−
1.5
2.0
−
−
V
Note
1. Tests are performed with application reference board. Tests with other boards will have different results.
1997 Oct 27 12
NXP [ NXP ]
